藉由濕式蝕刻搭配蒸鍍技術增強電鍍銅背電極應用於單晶矽太陽能電池之特性研究...
周彥承

 

  • 藉由濕式蝕刻搭配蒸鍍技術增強電鍍銅背電極應用於單晶矽太陽能電池之特性研究 = = Improved Characteristics of Electroplating Copper as Rear Electrode of Monocrystalline Silicon Solar Cells by Wet Etching and Evaporation Process /
  • Record Type: Language materials, printed : Monograph/item
    Title/Author: 藉由濕式蝕刻搭配蒸鍍技術增強電鍍銅背電極應用於單晶矽太陽能電池之特性研究 = / 周彥承撰.
    Reminder of title: Improved Characteristics of Electroplating Copper as Rear Electrode of Monocrystalline Silicon Solar Cells by Wet Etching and Evaporation Process /
    remainder title: Improved Characteristics of Electroplating Copper as Rear Electrode of Monocrystalline Silicon Solar Cells by Wet Etching and Evaporation Process.
    Author: 周彥承
    Published: 雲林縣 : 國立虎尾科技大學 , : 民105.06.,
    Description: [10], 89面 : 圖, 表 ; : 30公分.;
    Notes: 指導教授:鄭錦隆,莊為群.
    Subject: 濕蝕刻. -
    Online resource: http://cetd.lib.nfu.edu.tw/etdservice/view_metadata?etdun=U0028-1706201617355400
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  • 2 records • Pages 1 •
 
T007944 圖書館B1F 博碩士論文專區 不流通(NON_CIR) 碩士論文(TM) TM 008.166M 7701 105 一般使用(Normal) On shelf 0
T007945 圖書館B1F 可外借論文區 不流通(NON_CIR) 一般圖書 008.166M 7701 105 c.2 一般使用(Normal) On shelf 0
  • 2 records • Pages 1 •
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