Modeling and design of electromagnet...
Wei, Xing-Chang.

 

  • Modeling and design of electromagnetic compatibility for high-speed printed circuit boards and packaging /
  • Record Type: Language materials, printed : Monograph/item
    Title/Author: Modeling and design of electromagnetic compatibility for high-speed printed circuit boards and packaging // Xing-Chang Wei.
    Author: Wei, Xing-Chang.
    Published: Boca Raton :CRC Press, : c2017.,
    Description: xviii, 322 p. :ill. ; : 24 cm.;
    Subject: Printed circuits - Design and construction. -
    ISBN: 9781138033566 (cloth) :
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  • 1 records • Pages 1 •
 
E044477 圖書館3F 書庫 一般圖書(BOOK) 一般圖書 621.381531 W415 2017 一般使用(Normal) On shelf 0
  • 1 records • Pages 1 •
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