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Modeling and design of electromagnet...

Wei, Xing-Chang.

Modeling and design of electromagnetic compatibility for high-speed printed circuit boards and packaging /

紀錄類型:	書目-語言資料,印刷品 : Monograph/item
正題名/作者:	Modeling and design of electromagnetic compatibility for high-speed printed circuit boards and packaging // Xing-Chang Wei.
作者:	Wei, Xing-Chang.
出版者:	Boca Raton :CRC Press, : c2017.,
面頁冊數:	xviii, 322 p. :ill. ; : 24 cm.;
標題:	Printed circuits - Design and construction. -
ISBN:	9781138033566 (cloth) :

Modeling and design of electromagnetic compatibility for high-speed printed circuit boards and packaging /
Wei, Xing-Chang.

Modeling and design of electromagnetic compatibility for high-speed printed circuit boards and packaging /Xing-Chang Wei. - Boca Raton :CRC Press,c2017. - xviii, 322 p. :ill. ;24 cm.

Includes bibliographical references and index.

ISBN: 9781138033566 (cloth) :NT4622

LCCN: 2016053999 Subjects--Topical Terms:

598448
Printed circuits
--Design and construction.

LC Class. No.: TK7868.P7 / W44 2017

Dewey Class. No.: 621.3815/31

Modeling and design of electromagnetic compatibility for high-speed printed circuit boards and packaging /
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245 1 0 $a Modeling and design of electromagnetic compatibility for high-speed printed circuit boards and packaging / $c Xing-Chang Wei.
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