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Modeling and design of electromagnet...
~
Wei, Xing-Chang.
Modeling and design of electromagnetic compatibility for high-speed printed circuit boards and packaging /
Record Type:
Language materials, printed : Monograph/item
Title/Author:
Modeling and design of electromagnetic compatibility for high-speed printed circuit boards and packaging // Xing-Chang Wei.
Author:
Wei, Xing-Chang.
Published:
Boca Raton :CRC Press, : c2017.,
Description:
xviii, 322 p. :ill. ; : 24 cm.;
Subject:
Printed circuits - Design and construction. -
ISBN:
9781138033566 (cloth) :
Modeling and design of electromagnetic compatibility for high-speed printed circuit boards and packaging /
Wei, Xing-Chang.
Modeling and design of electromagnetic compatibility for high-speed printed circuit boards and packaging /
Xing-Chang Wei. - Boca Raton :CRC Press,c2017. - xviii, 322 p. :ill. ;24 cm.
Includes bibliographical references and index.
ISBN: 9781138033566 (cloth) :NT4622
LCCN: 2016053999 Subjects--Topical Terms:
598448
Printed circuits
--Design and construction.
LC Class. No.: TK7868.P7 / W44 2017
Dewey Class. No.: 621.3815/31
Modeling and design of electromagnetic compatibility for high-speed printed circuit boards and packaging /
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Wei, Xing-Chang.
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Modeling and design of electromagnetic compatibility for high-speed printed circuit boards and packaging /
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Xing-Chang Wei.
260
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Boca Raton :
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CRC Press,
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c2017.
300
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xviii, 322 p. :
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ill. ;
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24 cm.
504
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Includes bibliographical references and index.
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Printed circuits
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Design and construction.
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598448
650
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Electronic packaging.
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556061
650
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Electromagnetic compatibility.
$3
563969
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