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Advanced interconnects for ULSI technology

Record Type:	Language materials, printed : Monograph/item
Title/Author:	Advanced interconnects for ULSI technology/ [edited by] Mikhail Baklanov, Paul S. Ho, Ehrenfried Zschech.
other author:	Baklanov, Mikhail.
Published:	Hoboken, NJ :Wiley, : 2012.,
Description:	1 online resource.
Notes:	Wiley online library (ebook collection)
Contained By:	EBL
Subject:	Interconnects (Integrated circuit technology) -
Online resource:	http://dx.doi.org/10.1002/9781119963677
ISBN:	9781119963240 (electronic bk.)

Advanced interconnects for ULSI technology
Advanced interconnects for ULSI technology[electronic resource] /[edited by] Mikhail Baklanov, Paul S. Ho, Ehrenfried Zschech. - Hoboken, NJ :Wiley,2012. - 1 online resource.

Wiley online library (ebook collection)

Includes bibliographical references and index.

Front Matter -- Colour Plates -- Section I: Low-. Low- Materials: Recent Advances / Geraud Dubois, Willi Volksen -- Ultra-Low- by CVD: Deposition and Curing / Vincent Jousseaume, Aziz Zenasni, Olivier Gourhant, Laurent Favennec, Mikhail R Baklanov -- Plasma Processing of Low- Dielectrics / Hualiang Shi, Denis Shamiryan, Jean-Fraṅois de Marneffe, Huai Huang, Paul S Ho, Mikhail R Baklanov -- Wet Clean Applications in Porous Low- Patterning Processes / Quoc Toan Le, Guy Vereecke, Herbert Struyf, Els Kesters, Mikhail R Baklanov -- Section II: Conductive Layers and Barriers. Copper Electroplating for On-Chip Metallization / Valery M Dubin -- Diffusion Barriers / Michael Hecker, Rene Hubner -- Section III: Integration and Reliability. Process Integration of Interconnects / Sridhar Balakrishnan, Ruth Brain, Larry Zhao -- Chemical Mechanical Planarization for Cu₆Low- Integration / Gautam Banerjee -- Scaling and Microstructure Effects on Electromigration Reliability for Cu Interconnects / Chao-Kun Hu, Rene Hubner, Lijuan Zhang, Meike Hauschildt, Paul S Ho -- Mechanical Reliability of Low- Dielectrics / Kris Vanstreels, Han Li, Joost J Vlassak -- Electrical Breakdown in Advanced Interconnect Dielectrics / Ennis T Ogawa, Oliver Aubel -- Section IV: New Approaches. 3D Interconnect Technology / John U Knickerbocker, Lay Wai Kong, Sven Niese, Alain Diebold, Ehrenfried Zschech -- Carbon Nanotubes for Interconnects / Mizuhisa Nihei, Motonobu Sato, Akio Kawabata, Shintaro Sato, Yuji Awano -- Optical Interconnects / Wim Bogaerts -- Wireless Interchip Interconnects / Takamaro Kikkawa -- Index.

"This book presents an in-depth overview of present status, novel developments and new materials and approaches for advanced interconnect technology"--

ISBN: 9781119963240 (electronic bk.)

Standard No.: 9786613620637

Source: 10.1002/9781119963677Wiley InterSciencehttp://www3.interscience.wiley.comSubjects--Topical Terms:

655374
Interconnects (Integrated circuit technology)

LC Class. No.: TK7874.53 / .A39 2012eb

Dewey Class. No.: 621.39/5

Advanced interconnects for ULSI technology
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245 0 0 $a Advanced interconnects for ULSI technology $h [electronic resource] / $c [edited by] Mikhail Baklanov, Paul S. Ho, Ehrenfried Zschech.
260 $a Hoboken, NJ : $b Wiley, $c 2012.
300 $a 1 online resource.
500 $a Wiley online library (ebook collection)
504 $a Includes bibliographical references and index.
505 0 $a Front Matter -- Colour Plates -- Section I: Low-. Low- Materials: Recent Advances / Geraud Dubois, Willi Volksen -- Ultra-Low- by CVD: Deposition and Curing / Vincent Jousseaume, Aziz Zenasni, Olivier Gourhant, Laurent Favennec, Mikhail R Baklanov -- Plasma Processing of Low- Dielectrics / Hualiang Shi, Denis Shamiryan, Jean-Fraṅois de Marneffe, Huai Huang, Paul S Ho, Mikhail R Baklanov -- Wet Clean Applications in Porous Low- Patterning Processes / Quoc Toan Le, Guy Vereecke, Herbert Struyf, Els Kesters, Mikhail R Baklanov -- Section II: Conductive Layers and Barriers. Copper Electroplating for On-Chip Metallization / Valery M Dubin -- Diffusion Barriers / Michael Hecker, Rene Hubner -- Section III: Integration and Reliability. Process Integration of Interconnects / Sridhar Balakrishnan, Ruth Brain, Larry Zhao -- Chemical Mechanical Planarization for Cu₆Low- Integration / Gautam Banerjee -- Scaling and Microstructure Effects on Electromigration Reliability for Cu Interconnects / Chao-Kun Hu, Rene Hubner, Lijuan Zhang, Meike Hauschildt, Paul S Ho -- Mechanical Reliability of Low- Dielectrics / Kris Vanstreels, Han Li, Joost J Vlassak -- Electrical Breakdown in Advanced Interconnect Dielectrics / Ennis T Ogawa, Oliver Aubel -- Section IV: New Approaches. 3D Interconnect Technology / John U Knickerbocker, Lay Wai Kong, Sven Niese, Alain Diebold, Ehrenfried Zschech -- Carbon Nanotubes for Interconnects / Mizuhisa Nihei, Motonobu Sato, Akio Kawabata, Shintaro Sato, Yuji Awano -- Optical Interconnects / Wim Bogaerts -- Wireless Interchip Interconnects / Takamaro Kikkawa -- Index.
520 $a "This book presents an in-depth overview of present status, novel developments and new materials and approaches for advanced interconnect technology"-- $c Provided by publisher.
588 $a Description based on print version record.
650 0 $a Interconnects (Integrated circuit technology) $3 655374
650 0 $a Integrated circuits $x Ultra large scale integration. $3 785348
650 7 $a TECHNOLOGY & ENGINEERING / Electronics / Circuits / VLSI & ULSI. $2 bisacsh $3 1132009
650 7 $a COMPUTERS / Logic Design $2 bisacsh $3 1132010
650 7 $a TECHNOLOGY & ENGINEERING / Electronics / Circuits / Logic $2 bisacsh $3 1132011
700 1 $a Baklanov, Mikhail. $3 1132007
700 1 $a Ho, P. S. $3 1132008
700 1 $a Zschech, Ehrenfried. $3 671209
773 0 $t EBL
856 4 0 $u http://dx.doi.org/10.1002/9781119963677