| Record Type: |
Language materials, printed
: Monograph/item
|
| Title/Author: |
電子構裝與銅表面處理技術 = / 何政恩著. |
| Reminder of title: |
Electronic packages and surfacefinish technology of copper / |
| remainder title: |
Electronic packages and surface finish technology ofcopper |
| Author: |
何政恩, |
| Published: |
桃園市 : 臺灣電路板協會, : 2018.06., |
| Description: |
238面 : 部份彩圖, 彩像, 表格 ; : 26公分; |
| Notes: |
含參考書目 |
| Subject: |
表面處理 - |
| ISBN: |
9789869382946 |