| Record Type: |
Language materials, printed
: Monograph/item
|
| Title/Author: |
Solder materials // Kwang-Lung Lin. |
| Author: |
Lin, Kwang-lung. |
| Published: |
Hackensack, NJ ;World Scientific Publishing Co. Pte. Ltd., : c2018., |
| Description: |
xi, 375 p. :ill. ; : 24 cm.; |
| Subject: |
Solder pastes. - |
| ISBN: |
9789813237605 : |