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3D IC and RF SiPs = advanced stackin...
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Horng, Tzyy-sheng Jason.
3D IC and RF SiPs = advanced stacking and planar solutions for 5G mobility /
紀錄類型:
書目-語言資料,印刷品 : Monograph/item
正題名/作者:
3D IC and RF SiPs/ Lih-Tyng Hwang, Tzyy-Sheng Jason Horng.
其他題名:
advanced stacking and planar solutions for 5G mobility /
作者:
Hwang, Lih-Tyng.
其他作者:
Horng, Tzyy-sheng Jason.
出版者:
Hoboken, NJ :John Wiley & Sons : : 2018.,
面頁冊數:
1 online resource.
標題:
Mobile communication systems - Technological innovations. -
電子資源:
https://onlinelibrary.wiley.com/doi/book/10.1002/9781119289654
ISBN:
9781119289654
3D IC and RF SiPs = advanced stacking and planar solutions for 5G mobility /
Hwang, Lih-Tyng.
3D IC and RF SiPs
advanced stacking and planar solutions for 5G mobility /[electronic resource] :Lih-Tyng Hwang, Tzyy-Sheng Jason Horng. - 1st ed. - Hoboken, NJ :John Wiley & Sons :2018. - 1 online resource.
Includes bibliographical references and index.
Front Matter -- MM and MTM for Mobility -- Interconnects -- State-of-the-Art IC Packages, Modules, and Substrates -- Passives Technology -- Electrical Design for 5G Hardware-Digital Focus -- Electrical Design for 5G Hardware-RF Focus -- Product, Process Development, and Control -- Product Life and Reliability Assessment -- Hardware Solutions for 5G Mobility -- Appendices. A. Failure Mechanisms and Failure Analysis -- B. ANOVA -- C. Gauge R&R and DOE -- D. Statistics Tables -- Index
ISBN: 9781119289654
LCCN: 2018000679Subjects--Topical Terms:
833045
Mobile communication systems
--Technological innovations.
LC Class. No.: TK5103.2
Dewey Class. No.: 621.39/5
3D IC and RF SiPs = advanced stacking and planar solutions for 5G mobility /
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https://onlinelibrary.wiley.com/doi/book/10.1002/9781119289654
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