國立虎尾科技大學 |

The influence of the effective physical properties of tin electrodeposited films on the growth of tin whiskers.

紀錄類型:	書目-語言資料,手稿 : Monograph/item
正題名/作者:	The influence of the effective physical properties of tin electrodeposited films on the growth of tin whiskers./
作者:	Pedigo, Aaron E.
面頁冊數:	1 online resource (145 pages)
附註:	Source: Dissertation Abstracts International, Volume: 73-01, Section: B, page: 5520.
Contained By:	Dissertation Abstracts International73-01B.
標題:	Materials science. -
電子資源:	click for full text (PQDT)
ISBN:	9781124945453

The influence of the effective physical properties of tin electrodeposited films on the growth of tin whiskers.
Pedigo, Aaron E.

The influence of the effective physical properties of tin electrodeposited films on the growth of tin whiskers. - 1 online resource (145 pages)

Source: Dissertation Abstracts International, Volume: 73-01, Section: B, page: 5520.

Thesis (Ph.D.)

Includes bibliographical references

The purpose of the present study was to characterize and calculate the effective film properties of electrodeposited tin films to determine factors influencing the growth of tin (Sn) whiskers. The growth of Sn whiskers represents an increased risk to the reliability of electronic devices, and is a particular concern in the high reliability environments demanded in aerospace and defense applications. Efforts to prevent whisker growth have proven difficult, in part, due to the lack of understanding concerning the fundamental mechanisms responsible for whisker growth. In the present study, Sn, Sn-Cu, and Sn Cu Pb films were electrodeposited from commercial electrolytes with different deposition parameters. The morphology of Sn hillocks and whiskers were characterized leading to a growth model considering the role of grain boundary mobility. Crystallographic texture measurements revealed non-random textures, dependent on electrolyte type, electrolyte additives, deposition current density, and film thickness. The crystallographic texture was also found to evolve with time, indicating recrystallization and grain growth. The corresponding textures were used to calculate the effective physical properties of the films, showing significant differences in the linear modulus of elasticity, biaxial modulus of elasticity, and coefficient of thermal expansion. The influence of these effective properties on the strain energy density of the film was analyzed with respect to the evolution of crystallographic texture and film stress. The results show that the reduction of strain energy and surface energy is not the only driving force dictating the evolution of the crystallographic texture. Recommendations are made for future studies to apply the analysis tools developed in this study for future whisker research, as well as for industrial applications.

Electronic reproduction.
Ann Arbor, Mich. :
ProQuest,
2018

Mode of access: World Wide Web

ISBN: 9781124945453Subjects--Topical Terms:

557839
Materials science.
Index Terms--Genre/Form:

554714
Electronic books.

The influence of the effective physical properties of tin electrodeposited films on the growth of tin whiskers.
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245 1 4 $a The influence of the effective physical properties of tin electrodeposited films on the growth of tin whiskers.
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500 $a Source: Dissertation Abstracts International, Volume: 73-01, Section: B, page: 5520.
500 $a Advisers: Carol A. Handwerker; John E. Blendell.
502 $a Thesis (Ph.D.) $c Purdue University $d 2011.
504 $a Includes bibliographical references
520 $a The purpose of the present study was to characterize and calculate the effective film properties of electrodeposited tin films to determine factors influencing the growth of tin (Sn) whiskers. The growth of Sn whiskers represents an increased risk to the reliability of electronic devices, and is a particular concern in the high reliability environments demanded in aerospace and defense applications. Efforts to prevent whisker growth have proven difficult, in part, due to the lack of understanding concerning the fundamental mechanisms responsible for whisker growth. In the present study, Sn, Sn-Cu, and Sn Cu Pb films were electrodeposited from commercial electrolytes with different deposition parameters. The morphology of Sn hillocks and whiskers were characterized leading to a growth model considering the role of grain boundary mobility. Crystallographic texture measurements revealed non-random textures, dependent on electrolyte type, electrolyte additives, deposition current density, and film thickness. The crystallographic texture was also found to evolve with time, indicating recrystallization and grain growth. The corresponding textures were used to calculate the effective physical properties of the films, showing significant differences in the linear modulus of elasticity, biaxial modulus of elasticity, and coefficient of thermal expansion. The influence of these effective properties on the strain energy density of the film was analyzed with respect to the evolution of crystallographic texture and film stress. The results show that the reduction of strain energy and surface energy is not the only driving force dictating the evolution of the crystallographic texture. Recommendations are made for future studies to apply the analysis tools developed in this study for future whisker research, as well as for industrial applications.
533 $a Electronic reproduction. $b Ann Arbor, Mich. : $c ProQuest, $d 2018
538 $a Mode of access: World Wide Web
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690 $a 0794
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710 2 $a Purdue University. $b Materials Engineering. $3 1182070
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