國立虎尾科技大學 |

Moisture Absorption and Hygroscopic Swelling of Silicone/Phosphor Composite and Epoxy Mold Compound in Chip-on-Board Light Emitting Diodes.

紀錄類型:	書目-語言資料,手稿 : Monograph/item
正題名/作者:	Moisture Absorption and Hygroscopic Swelling of Silicone/Phosphor Composite and Epoxy Mold Compound in Chip-on-Board Light Emitting Diodes./
作者:	Khalilullah, Ibrahim.
面頁冊數:	1 online resource (70 pages)
附註:	Source: Masters Abstracts International, Volume: 57-02.
Contained By:	Masters Abstracts International57-02(E).
標題:	Mechanical engineering. -
電子資源:	click for full text (PQDT)
ISBN:	9780355369229

Moisture Absorption and Hygroscopic Swelling of Silicone/Phosphor Composite and Epoxy Mold Compound in Chip-on-Board Light Emitting Diodes.
Khalilullah, Ibrahim.

Moisture Absorption and Hygroscopic Swelling of Silicone/Phosphor Composite and Epoxy Mold Compound in Chip-on-Board Light Emitting Diodes. - 1 online resource (70 pages)

Source: Masters Abstracts International, Volume: 57-02.

Thesis (M.E.S.)

Includes bibliographical references

Silicone and epoxy-based materials are widely used in light emitting diode (LED) packaging. Optical grade silicones are used as light path material and also function as protective lenses, stress relieving encapsulant and mechanical protection, while epoxies are used as packaging materials. This thesis investigates the moisture absorption and hygroscopic swelling behaviors of a new silicone/phosphor composite and a common epoxy molding compound (EMC) used in a new generation chip on board (COB) white light LED. Moisture absorption was tested in-situ using TA Instruments TGA Q5000 SA. The test temperatures were 30°C, 60°C, and 80°C. At each isothermal temperature, relative humidity conditions were selected as 30%, 60%, and 80%. Hygroscopic swelling tests were performed in TA Instruments DMA Q800 DMA-RH at 60°C. Moisture diffusivity, saturated moisture content, activation energy, and coefficients of hygroscopic swelling were calculated from experimental data and presented in this thesis. It was found that the silicone/phosphor composite shows Fickian diffusion while EMC shows non-Fickian diffusion. In addition, silicone/phosphor composite was subjected to permanent damage due to moisture, but EMC recovered partially upon desorption. The results obtained in this work can be used for designing the reliability of LEDs subjected to severe outdoor conditions.

Electronic reproduction.
Ann Arbor, Mich. :
ProQuest,
2018

Mode of access: World Wide Web

ISBN: 9780355369229Subjects--Topical Terms:

557493
Mechanical engineering.
Index Terms--Genre/Form:

554714
Electronic books.

Moisture Absorption and Hygroscopic Swelling of Silicone/Phosphor Composite and Epoxy Mold Compound in Chip-on-Board Light Emitting Diodes.
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500 $a Source: Masters Abstracts International, Volume: 57-02.
500 $a Adviser: Xuejun Fan.
502 $a Thesis (M.E.S.) $c Lamar University - Beaumont $d 2017.
504 $a Includes bibliographical references
520 $a Silicone and epoxy-based materials are widely used in light emitting diode (LED) packaging. Optical grade silicones are used as light path material and also function as protective lenses, stress relieving encapsulant and mechanical protection, while epoxies are used as packaging materials. This thesis investigates the moisture absorption and hygroscopic swelling behaviors of a new silicone/phosphor composite and a common epoxy molding compound (EMC) used in a new generation chip on board (COB) white light LED. Moisture absorption was tested in-situ using TA Instruments TGA Q5000 SA. The test temperatures were 30°C, 60°C, and 80°C. At each isothermal temperature, relative humidity conditions were selected as 30%, 60%, and 80%. Hygroscopic swelling tests were performed in TA Instruments DMA Q800 DMA-RH at 60°C. Moisture diffusivity, saturated moisture content, activation energy, and coefficients of hygroscopic swelling were calculated from experimental data and presented in this thesis. It was found that the silicone/phosphor composite shows Fickian diffusion while EMC shows non-Fickian diffusion. In addition, silicone/phosphor composite was subjected to permanent damage due to moisture, but EMC recovered partially upon desorption. The results obtained in this work can be used for designing the reliability of LEDs subjected to severe outdoor conditions.
533 $a Electronic reproduction. $b Ann Arbor, Mich. : $c ProQuest, $d 2018
538 $a Mode of access: World Wide Web
650 4 $a Mechanical engineering. $3 557493
655 7 $a Electronic books. $2 local $3 554714
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710 2 $a Lamar University - Beaumont. $b Mechanical Engineering. $3 1179007
773 0 $t Masters Abstracts International $g 57-02(E).
856 4 0 $u http://pqdd.sinica.edu.tw/twdaoapp/servlet/advanced?query=10619193 $z click for full text (PQDT)