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Design of Experiment Analysis of an Electronics Package Lid Using Finite Element Analysis.

Record Type:	Language materials, manuscript : Monograph/item
Title/Author:	Design of Experiment Analysis of an Electronics Package Lid Using Finite Element Analysis./
Author:	Bajad, Nupur.
Description:	1 online resource (66 pages)
Notes:	Source: Masters Abstracts International, Volume: 57-01.
Contained By:	Masters Abstracts International57-01(E).
Subject:	Engineering. -
Online resource:	click for full text (PQDT)
ISBN:	9780355507775

Design of Experiment Analysis of an Electronics Package Lid Using Finite Element Analysis.
Bajad, Nupur.

Design of Experiment Analysis of an Electronics Package Lid Using Finite Element Analysis. - 1 online resource (66 pages)

Source: Masters Abstracts International, Volume: 57-01.

Thesis (M.S.)

Includes bibliographical references

design of experiment analysis is reported on data from warpage simulations using finite element analysis of a lidded electronics package. Warpage in a lid of an optical electronics package can detrimentally affect the reliability of the package as well as its optical performance. The present study focuses on the variety of materials and designs of lids relevant to recent technologies in electronics packaging. The finite element analysis (FEA) formulation in this study accurately predicts deformation and warpage in the elastic region with optimal computational time achieved through a choice of boundary conditions and mesh sensitivity studies.

Electronic reproduction.
Ann Arbor, Mich. :
ProQuest,
2018

Mode of access: World Wide Web

ISBN: 9780355507775Subjects--Topical Terms:

561152
Engineering.
Index Terms--Genre/Form:

554714
Electronic books.

Design of Experiment Analysis of an Electronics Package Lid Using Finite Element Analysis.
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100 1 $a Bajad, Nupur. $3 1183045
245 1 0 $a Design of Experiment Analysis of an Electronics Package Lid Using Finite Element Analysis.
264 0 $c 2017
300 $a 1 online resource (66 pages)
336 $a text $b txt $2 rdacontent
337 $a computer $b c $2 rdamedia
338 $a online resource $b cr $2 rdacarrier
500 $a Source: Masters Abstracts International, Volume: 57-01.
500 $a Advisers: Daryl L. Santos; Sang W. Yoon.
502 $a Thesis (M.S.) $c State University of New York at Binghamton $d 2017.
504 $a Includes bibliographical references
520 $a design of experiment analysis is reported on data from warpage simulations using finite element analysis of a lidded electronics package. Warpage in a lid of an optical electronics package can detrimentally affect the reliability of the package as well as its optical performance. The present study focuses on the variety of materials and designs of lids relevant to recent technologies in electronics packaging. The finite element analysis (FEA) formulation in this study accurately predicts deformation and warpage in the elastic region with optimal computational time achieved through a choice of boundary conditions and mesh sensitivity studies.
520 $a The results from FEA are compared to analytical calculations made using the classical laminate plate theory (CLPT) as well as the modified Suhir's theory. It is observed that FEA results are more accurate as they account for the performance of die attach/ underfill materials regardless of the small thickness of the layer. The FEA data are finally used to conduct a design of experiments (DOE) analysis to investigate the influence of 3 distinct designs and 6 material choices on warpage of a lid. The analysis indicates that there is no significant interaction between the two parameters expected to affect the warpage in the lid. Material properties of the lid are found to have a greater effect on the warpage of the lid as compared to variabilities introduced in lid designs in this study. The FEA simulations performed consider only material behavior within the elastic limit and, in some situations, plastic deformation may occur which is more permanent and as such requires a more comprehensive analysis in the plastic region to enhance the data set for DOE studies.
533 $a Electronic reproduction. $b Ann Arbor, Mich. : $c ProQuest, $d 2018
538 $a Mode of access: World Wide Web
650 4 $a Engineering. $3 561152
650 4 $a Industrial engineering. $3 679492
650 4 $a Systems science. $3 1148479
655 7 $a Electronic books. $2 local $3 554714
690 $a 0537
690 $a 0546
690 $a 0790
710 2 $a ProQuest Information and Learning Co. $3 1178819
710 2 $a State University of New York at Binghamton. $b Systems Science Industrial Engineering. $3 1182293
773 0 $t Masters Abstracts International $g 57-01(E).
856 4 0 $u http://pqdd.sinica.edu.tw/twdaoapp/servlet/advanced?query=10682797 $z click for full text (PQDT)