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Quilt packaging : = A novel high speed chip -to -chip communication paradigm for system -in -package.

Record Type:	Language materials, manuscript : Monograph/item
Title/Author:	Quilt packaging :/
Reminder of title:	A novel high speed chip -to -chip communication paradigm for system -in -package.
Author:	Liu, Qing.
Description:	1 online resource (213 pages)
Notes:	Source: Dissertation Abstracts International, Volume: 69-01, Section: B, page: 5560.
Contained By:	Dissertation Abstracts International69-01B.
Subject:	Electrical engineering. -
Online resource:	click for full text (PQDT)
ISBN:	9780549434641

Quilt packaging : = A novel high speed chip -to -chip communication paradigm for system -in -package.
Liu, Qing.

Quilt packaging :A novel high speed chip -to -chip communication paradigm for system -in -package. - 1 online resource (213 pages)

Source: Dissertation Abstracts International, Volume: 69-01, Section: B, page: 5560.

Thesis (Ph.D.)--University of Notre Dame, 2008.

Includes bibliographical references

As state-of-the-art transistor features continue to shrink and the incorporation of high-k, low-k isolation dielectric materials and strained and SiGe layers on silicon becomes common, chip density and performance are improved. However, system performance has not kept up with the pace especially at multi-GHz clock rates. The bottleneck is packaging. Conventional packaging techniques require high driving current and large in-die area for bonding pads, and provide limited bandwidth. As a result, several technologies, such as system-on-chip, system-in-packaging and system-on-packaging, have been actively pursed to meet the demands of low power, high I/O counts and fast chip-to-chip communication. Here, we present a novel packaging technique, Quilt Packaging (QP), for system-in-package. QP uses microelectromechanical systems (MEMS) inspired fabrication techniques to form contacts along the vertical edge facets of the integrated circuits (ICs) during the back-end-of-line process, enabling the ICs to be interconnected by butting them against each other. A shorter path between chips is established compared with other system-in-packaging techniques pursued by industry, which leads to shorter delay, less power consumption and better signal integrity. The contacts are formed by copper nodules embedded inside the silicon substrate. Nodules are made of trenches into the silicon substrate by deep reactive ion etch (DRIE), which are filled by electrolytic copper plating followed by chemical-mechanical polishing (CMP). Different QP structures are fabricated with nodule depth of 20 mum and widths from 10 mum to 100 mum. To further improve the transmission performance, tapered nodules, which provide better impedance matching to on-chip interconnects, are designed and fabricated.

Electronic reproduction.
Ann Arbor, Mich. :
ProQuest,
2018

Mode of access: World Wide Web

ISBN: 9780549434641Subjects--Topical Terms:

596380
Electrical engineering.
Index Terms--Genre/Form:

554714
Electronic books.

Quilt packaging : = A novel high speed chip -to -chip communication paradigm for system -in -package.
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100 1 $a Liu, Qing. $3 1071396
245 1 0 $a Quilt packaging : $b A novel high speed chip -to -chip communication paradigm for system -in -package.
264 0 $c 2008
300 $a 1 online resource (213 pages)
336 $a text $b txt $2 rdacontent
337 $a computer $b c $2 rdamedia
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500 $a Source: Dissertation Abstracts International, Volume: 69-01, Section: B, page: 5560.
500 $a Adviser: Gary H. Bernstein.
502 $a Thesis (Ph.D.)--University of Notre Dame, 2008.
504 $a Includes bibliographical references
520 $a As state-of-the-art transistor features continue to shrink and the incorporation of high-k, low-k isolation dielectric materials and strained and SiGe layers on silicon becomes common, chip density and performance are improved. However, system performance has not kept up with the pace especially at multi-GHz clock rates. The bottleneck is packaging. Conventional packaging techniques require high driving current and large in-die area for bonding pads, and provide limited bandwidth. As a result, several technologies, such as system-on-chip, system-in-packaging and system-on-packaging, have been actively pursed to meet the demands of low power, high I/O counts and fast chip-to-chip communication. Here, we present a novel packaging technique, Quilt Packaging (QP), for system-in-package. QP uses microelectromechanical systems (MEMS) inspired fabrication techniques to form contacts along the vertical edge facets of the integrated circuits (ICs) during the back-end-of-line process, enabling the ICs to be interconnected by butting them against each other. A shorter path between chips is established compared with other system-in-packaging techniques pursued by industry, which leads to shorter delay, less power consumption and better signal integrity. The contacts are formed by copper nodules embedded inside the silicon substrate. Nodules are made of trenches into the silicon substrate by deep reactive ion etch (DRIE), which are filled by electrolytic copper plating followed by chemical-mechanical polishing (CMP). Different QP structures are fabricated with nodule depth of 20 mum and widths from 10 mum to 100 mum. To further improve the transmission performance, tapered nodules, which provide better impedance matching to on-chip interconnects, are designed and fabricated.
520 $a QP is a novel packaging technique for ultra-fast and low-power chip-to-chip communications. The fabrication process of QP can be easily integrated into standard IC process with an extra two masks, one for the nodules and the other for the separation of the chips. The system performance by implementing QP can be dramatically improved along with the improvement of the ICs trends.
533 $a Electronic reproduction. $b Ann Arbor, Mich. : $c ProQuest, $d 2018
538 $a Mode of access: World Wide Web
650 4 $a Electrical engineering. $3 596380
655 7 $a Electronic books. $2 local $3 554714
690 $a 0544
710 2 $a ProQuest Information and Learning Co. $3 1178819
710 2 $a University of Notre Dame. $3 845534
773 0 $t Dissertation Abstracts International $g 69-01B.
856 4 0 $u http://pqdd.sinica.edu.tw/twdaoapp/servlet/advanced?query=3299159 $z click for full text (PQDT)