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Quality inspection and reliability study of solder bumps in packaged electronic devices : = Using laser ultrasound and finite element methods.

Record Type:	Language materials, manuscript : Monograph/item
Title/Author:	Quality inspection and reliability study of solder bumps in packaged electronic devices :/
Reminder of title:	Using laser ultrasound and finite element methods.
Author:	Yang, Jin.
Description:	1 online resource (296 pages)
Notes:	Source: Dissertation Abstracts International, Volume: 70-02, Section: B, page: 1310.
Contained By:	Dissertation Abstracts International70-02B.
Subject:	Mechanical engineering. -
Online resource:	click for full text (PQDT)
ISBN:	9781109012620

Quality inspection and reliability study of solder bumps in packaged electronic devices : = Using laser ultrasound and finite element methods.
Yang, Jin.

Quality inspection and reliability study of solder bumps in packaged electronic devices :Using laser ultrasound and finite element methods. - 1 online resource (296 pages)

Source: Dissertation Abstracts International, Volume: 70-02, Section: B, page: 1310.

Thesis (Ph.D.)--Georgia Institute of Technology, 2008.

Includes bibliographical references

Consumer demands are driving the current trend in the microelectronics industry to make electronic products that are miniature, fast, compact, high-density, reliable and low-cost. The use of surface mount devices has helped to decrease the size of electronic packages through the use of solder bump interconnections between the devices and the substrates/printed wiring boards (PWBs). Solder bumps act as not only mechanical, but also electrical interconnections between the device and the substrate/PWB. Common manufacturing defects---such as open, cracked, missing, and misaligned solder bumps---are difficult to detect because solder bumps are hidden between the device and the substrate/PWB after assembly. The reliability of packaged electronic devices in storage and usage is a major concern in the microelectronics industry. Therefore, quality inspection of solder bumps has become a critical process in the microelectronics industry to ensure product quality and reliability. The laser ultrasound-interferometric inspection system under development aims to provide a solution that can overcome some of the limitations of current inspection techniques. The fully developed system will be automated and capable of inspecting a broad range of solder bump defects in a variety of electronic packages.

Electronic reproduction.
Ann Arbor, Mich. :
ProQuest,
2018

Mode of access: World Wide Web

ISBN: 9781109012620Subjects--Topical Terms:

557493
Mechanical engineering.
Index Terms--Genre/Form:

554714
Electronic books.

Quality inspection and reliability study of solder bumps in packaged electronic devices : = Using laser ultrasound and finite element methods.
LDR:04117ntm a2200337Ki 4500 001 915994
005 20180907134545.5
006 m o u
007 cr mn||||a|a||
008 190606s2008 xx obm 000 0 eng d
020 $a 9781109012620
035 $a (MiAaPQ)AAI3346108
035 $a AAI3346108
040 $a MiAaPQ $b eng $c MiAaPQ $d NTU
100 1 $a Yang, Jin. $3 1189558
245 1 0 $a Quality inspection and reliability study of solder bumps in packaged electronic devices : $b Using laser ultrasound and finite element methods.
264 0 $c 2008
300 $a 1 online resource (296 pages)
336 $a text $b txt $2 rdacontent
337 $a computer $b c $2 rdamedia
338 $a online resource $b cr $2 rdacarrier
500 $a Source: Dissertation Abstracts International, Volume: 70-02, Section: B, page: 1310.
500 $a Adviser: I. Charles Ume.
502 $a Thesis (Ph.D.)--Georgia Institute of Technology, 2008.
504 $a Includes bibliographical references
520 $a Consumer demands are driving the current trend in the microelectronics industry to make electronic products that are miniature, fast, compact, high-density, reliable and low-cost. The use of surface mount devices has helped to decrease the size of electronic packages through the use of solder bump interconnections between the devices and the substrates/printed wiring boards (PWBs). Solder bumps act as not only mechanical, but also electrical interconnections between the device and the substrate/PWB. Common manufacturing defects---such as open, cracked, missing, and misaligned solder bumps---are difficult to detect because solder bumps are hidden between the device and the substrate/PWB after assembly. The reliability of packaged electronic devices in storage and usage is a major concern in the microelectronics industry. Therefore, quality inspection of solder bumps has become a critical process in the microelectronics industry to ensure product quality and reliability. The laser ultrasound-interferometric inspection system under development aims to provide a solution that can overcome some of the limitations of current inspection techniques. The fully developed system will be automated and capable of inspecting a broad range of solder bump defects in a variety of electronic packages.
520 $a A methodology for quality evaluation and reliability study of solder bumps in electronic packages has been proposed and developed using the non-destructive and non-contact laser ultrasound-interferometric technique, finite element and statistical methods in this research work. This methodology includes the following aspects: (1) inspection pattern---specific inspection patterns are created according to inspection purpose and package formats, (2) laser pulse energy density calibration---specific laser pulse power and excitation laser spot size are selected in terms of package formats, (3) processing and analysis methods, including integrated analytical, finite element and experimental modal analyses approach, advanced signal processing methods and statistical analysis method, (4) approach combining modal analysis and advanced signal processing to improve measurement sensitivity of laser ultrasound-interferometric inspection technique, and (5) calibration curve using energy based simulation method and laser ultrasound inspection technique to predict thermomechanical reliability of solder bumps in electronic packages.
520 $a Because of the successful completion of the research objectives, the system has been used to evaluate a broad range of solder bump defects in a variety of packaged electronic devices. The development of this system will help tremendously to improve the quality and reliability of electronic packages, and this will save microelectronic and electronic packaging industry millions of dollars per year.
533 $a Electronic reproduction. $b Ann Arbor, Mich. : $c ProQuest, $d 2018
538 $a Mode of access: World Wide Web
650 4 $a Mechanical engineering. $3 557493
655 7 $a Electronic books. $2 local $3 554714
690 $a 0548
710 2 $a ProQuest Information and Learning Co. $3 1178819
710 2 $a Georgia Institute of Technology. $3 845427
773 0 $t Dissertation Abstracts International $g 70-02B.
856 4 0 $u http://pqdd.sinica.edu.tw/twdaoapp/servlet/advanced?query=3346108 $z click for full text (PQDT)