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Stress Response of Tall and Heavy Electronic Components Subjected to Multi-Axial Vibration.

紀錄類型:	書目-語言資料,手稿 : Monograph/item
正題名/作者:	Stress Response of Tall and Heavy Electronic Components Subjected to Multi-Axial Vibration./
作者:	Sridharan, Raman.
面頁冊數:	1 online resource (109 pages)
附註:	Source: Masters Abstracts International, Volume: 56-05.
Contained By:	Masters Abstracts International56-05(E).
標題:	Mechanical engineering. -
電子資源:	click for full text (PQDT)
ISBN:	9780355061567

Stress Response of Tall and Heavy Electronic Components Subjected to Multi-Axial Vibration.
Sridharan, Raman.

Stress Response of Tall and Heavy Electronic Components Subjected to Multi-Axial Vibration. - 1 online resource (109 pages)

Source: Masters Abstracts International, Volume: 56-05.

Thesis (M.S.)--University of Maryland, College Park, 2017.

Includes bibliographical references

Electronic assemblies often experience multiaxial vibration environments in use and tall, heavy components are more vulnerable when exposed to multiaxial vibration than are shorter, lighter assemblies. The added vulnerability comes from higher stresses that are a result of nonlinear dynamic amplification which large components are susceptible to under simultaneous multiaxial excitation, termed multi degree of freedom (MDoF) excitation. However, it is still common practice to conduct vibration durability testing on electronic assemblies one axis at a time -- in what is termed sequential single degree of freedom (SSDoF) testing. SSDoF testing has been shown to produce lower fatigue damage accumulation rates than simultaneous MDoF testing, in the leads of tall and heavy electronic components. This leads to overestimating the expected lifespan of the assembly.

Electronic reproduction.
Ann Arbor, Mich. :
ProQuest,
2018

Mode of access: World Wide Web

ISBN: 9780355061567Subjects--Topical Terms:

557493
Mechanical engineering.
Index Terms--Genre/Form:

554714
Electronic books.

Stress Response of Tall and Heavy Electronic Components Subjected to Multi-Axial Vibration.
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500 $a Source: Masters Abstracts International, Volume: 56-05.
500 $a Adviser: Abhijit Dasgupta.
502 $a Thesis (M.S.)--University of Maryland, College Park, 2017.
504 $a Includes bibliographical references
520 $a Electronic assemblies often experience multiaxial vibration environments in use and tall, heavy components are more vulnerable when exposed to multiaxial vibration than are shorter, lighter assemblies. The added vulnerability comes from higher stresses that are a result of nonlinear dynamic amplification which large components are susceptible to under simultaneous multiaxial excitation, termed multi degree of freedom (MDoF) excitation. However, it is still common practice to conduct vibration durability testing on electronic assemblies one axis at a time -- in what is termed sequential single degree of freedom (SSDoF) testing. SSDoF testing has been shown to produce lower fatigue damage accumulation rates than simultaneous MDoF testing, in the leads of tall and heavy electronic components. This leads to overestimating the expected lifespan of the assembly.
520 $a This paper investigates the geometric nonlinearities and the resulting cross-axis interactions that tall and heavy electronic components experience when subjected to vibration excitation along two orthogonal axes---one direction is in the plane of the PWB and the other is along the normal to the PWB. The direction normal to the PWB aligns with the axial direction of the leads, while the in-plane direction aligns with the primary bending direction of the leads. Harmonic excitation was simultaneously applied to both axes to study the vibration response as a function of frequency ratio and phase "difference" along the two axes. The experimental observations were verified with a nonlinear dynamic Finite Element study. The effect of geometric nonlinearity on cyclic stresses seen in the vibrating component are analyzed.
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538 $a Mode of access: World Wide Web
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