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A Study of RF/Microwave Components U...
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ProQuest Information and Learning Co.
A Study of RF/Microwave Components Using Fused Deposition Modeling and Micro-Dispensing.
紀錄類型:
書目-語言資料,手稿 : Monograph/item
正題名/作者:
A Study of RF/Microwave Components Using Fused Deposition Modeling and Micro-Dispensing./
作者:
Stephenson, Joshua A.
面頁冊數:
1 online resource (98 pages)
附註:
Source: Masters Abstracts International, Volume: 56-05.
Contained By:
Masters Abstracts International56-05(E).
標題:
Engineering. -
電子資源:
click for full text (PQDT)
ISBN:
9780355092196
A Study of RF/Microwave Components Using Fused Deposition Modeling and Micro-Dispensing.
Stephenson, Joshua A.
A Study of RF/Microwave Components Using Fused Deposition Modeling and Micro-Dispensing.
- 1 online resource (98 pages)
Source: Masters Abstracts International, Volume: 56-05.
Thesis (M.S.E.E.)--University of South Florida, 2017.
Includes bibliographical references
The design and study of multiple RF direct digital manufactured (DDM) devices are presented in this work. A 2.45 GHz, 180° hybrid coupler is designed to provide the space required for other system components. The coupler is designed and manufactured on a 32 mil Rogers 4003C substrate and adapted to a 100% in-fill acrylonitrile butadiene styrene (ABS) substrate. A size reduction of 66% is accomplished with a bandwidth of 16%. A DDM Ku band connector is modeled and fabricated using varying relative dielectric constants of 50% and 100% in-fill ABS. The connector maintains less than 0.45 dB of insertion loss up to 14 GHz and greater than 10dB of return loss up to 15 GHz. A lumped component model is also developed to model the damaged transition of the connector with agreement to numerical electromagnetic simulation software. Lastly, a thermal and RF study of a Ku band power amplifier (PA) is performed. Two 5 mil 100% in-fill ABS PA test fixtures are fabricated with a varying number of vias. The designs are biased at various operating points to collect thermal and RF data. The PA operates at 151°C before melting the ABS substrate. A thermal model is developed from the measurement data to predict the temperatures at given power levels with good agreement between simulation and model data.
Electronic reproduction.
Ann Arbor, Mich. :
ProQuest,
2018
Mode of access: World Wide Web
ISBN: 9780355092196Subjects--Topical Terms:
561152
Engineering.
Index Terms--Genre/Form:
554714
Electronic books.
A Study of RF/Microwave Components Using Fused Deposition Modeling and Micro-Dispensing.
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The design and study of multiple RF direct digital manufactured (DDM) devices are presented in this work. A 2.45 GHz, 180° hybrid coupler is designed to provide the space required for other system components. The coupler is designed and manufactured on a 32 mil Rogers 4003C substrate and adapted to a 100% in-fill acrylonitrile butadiene styrene (ABS) substrate. A size reduction of 66% is accomplished with a bandwidth of 16%. A DDM Ku band connector is modeled and fabricated using varying relative dielectric constants of 50% and 100% in-fill ABS. The connector maintains less than 0.45 dB of insertion loss up to 14 GHz and greater than 10dB of return loss up to 15 GHz. A lumped component model is also developed to model the damaged transition of the connector with agreement to numerical electromagnetic simulation software. Lastly, a thermal and RF study of a Ku band power amplifier (PA) is performed. Two 5 mil 100% in-fill ABS PA test fixtures are fabricated with a varying number of vias. The designs are biased at various operating points to collect thermal and RF data. The PA operates at 151°C before melting the ABS substrate. A thermal model is developed from the measurement data to predict the temperatures at given power levels with good agreement between simulation and model data.
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click for full text (PQDT)
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