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Modeling and Simulation of a Semicon...
~
Shinde, Aditya Ramaji.
Modeling and Simulation of a Semiconductor Manufcaturing Fab for Cycle Time Analysis.
紀錄類型:
書目-語言資料,手稿 : Monograph/item
正題名/作者:
Modeling and Simulation of a Semiconductor Manufcaturing Fab for Cycle Time Analysis./
作者:
Shinde, Aditya Ramaji.
面頁冊數:
1 online resource (105 pages)
附註:
Source: Masters Abstracts International, Volume: 58-01.
Contained By:
Masters Abstracts International58-01(E).
標題:
Industrial engineering. -
電子資源:
click for full text (PQDT)
ISBN:
9780438150546
Modeling and Simulation of a Semiconductor Manufcaturing Fab for Cycle Time Analysis.
Shinde, Aditya Ramaji.
Modeling and Simulation of a Semiconductor Manufcaturing Fab for Cycle Time Analysis.
- 1 online resource (105 pages)
Source: Masters Abstracts International, Volume: 58-01.
Thesis (M.S.)--University of Maryland, College Park, 2018.
Includes bibliographical references
The goal of the thesis is to conduct a study of the effects of scheduling policies and machine failures on the manufacturing cycle time of the Integrated Circuit (IC) manufacturing process for two processor chips, namely Skylake and Kabylake, manufactured by Intel. The fab simulation model was developed as First in First Out (FIFO), Shortest Processing Time (SPT), Priority based (PB), and Failure FIFO (machine failures) model, and the average cycle times and queue waiting times under the four scheduling policy models were compared for both the Skylake and Kabylake wafers. The study revealed that scheduling policies SPT and PB increased the average cycle time for Skylake wafers while decreasing the average cycle time for the Kabylake wafers, when compared to the base FIFO model. Machine failures increased the average cycle time for both types of wafers.
Electronic reproduction.
Ann Arbor, Mich. :
ProQuest,
2018
Mode of access: World Wide Web
ISBN: 9780438150546Subjects--Topical Terms:
679492
Industrial engineering.
Index Terms--Genre/Form:
554714
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The goal of the thesis is to conduct a study of the effects of scheduling policies and machine failures on the manufacturing cycle time of the Integrated Circuit (IC) manufacturing process for two processor chips, namely Skylake and Kabylake, manufactured by Intel. The fab simulation model was developed as First in First Out (FIFO), Shortest Processing Time (SPT), Priority based (PB), and Failure FIFO (machine failures) model, and the average cycle times and queue waiting times under the four scheduling policy models were compared for both the Skylake and Kabylake wafers. The study revealed that scheduling policies SPT and PB increased the average cycle time for Skylake wafers while decreasing the average cycle time for the Kabylake wafers, when compared to the base FIFO model. Machine failures increased the average cycle time for both types of wafers.
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