國立虎尾科技大學 |

Foundations of heterogeneous integration = an industry-based, 2.5D/3D pathfinding and co-design approach /

Record Type:	Language materials, printed : Monograph/item
Title/Author:	Foundations of heterogeneous integration/ by Farhang Yazdani.
Reminder of title:	an industry-based, 2.5D/3D pathfinding and co-design approach /
Author:	Yazdani, Farhang.
Published:	Cham :Springer International Publishing : : 2018.,
Description:	x, 177 p. :ill. (some col.), digital ; : 24 cm.;
Contained By:	Springer eBooks
Subject:	Engineering. -
Online resource:	http://dx.doi.org/10.1007/978-3-319-75769-8
ISBN:	9783319757698

Foundations of heterogeneous integration = an industry-based, 2.5D/3D pathfinding and co-design approach /
Yazdani, Farhang.

Foundations of heterogeneous integrationan industry-based, 2.5D/3D pathfinding and co-design approach /[electronic resource] :by Farhang Yazdani. - Cham :Springer International Publishing :2018. - x, 177 p. :ill. (some col.), digital ;24 cm.

Introduction -- Wirebond Physical Implementation -- Flip-Chip Physical Implementation -- Substrate Physical Implementation -- Conventional Design Flow -- Pathfinding and Co-Design.

This book provides a practical, hands-on approach to teach the foundation of 2.5D/3D heterogeneous design. Based on the author's extensive, industrial experience, this book enables integrated circuit design techniques that provide more memory to the logic chip, also allowing for mixing chips and intellectual property blocks from any vendor to build a more complex chip, more efficiently and cost effectively. Various practical examples and industrial projects are presented throughout the book, including questions and term projects at the end of each chapter. This book is a great resource for practicing engineers and can be used at universities to teach a course at the senior undergraduate and graduate level. Provides knowledge and skills necessary to design wirebond, flip chip and system in package (SIP) products; Provides practical solutions for 2.5D/3D memory and logic integration, explaining a complex, multidisciplinary topic in straightforward terms; Demonstrates a unique co-design methodology for optimizing cross domain heterogeneous integration, including examples, pathfinding, packaging strategy, interposer structure, etc.; Includes real, industry-based examples to give readers hands-on practical design experience.

ISBN: 9783319757698

Standard No.: 10.1007/978-3-319-75769-8doiSubjects--Topical Terms:

561152
Engineering.

LC Class. No.: TK7888.4 / .Y393 2018

Dewey Class. No.: 620.11

Foundations of heterogeneous integration = an industry-based, 2.5D/3D pathfinding and co-design approach /
LDR:02415nam a2200313 a 4500 001 925070
003 DE-He213
005 20180917091031.0
006 m d
007 cr nn 008maaau
008 190625s2018 gw s 0 eng d
020 $a 9783319757698 $q (electronic bk.)
020 $a 9783319757674 $q (paper)
024 7 $a 10.1007/978-3-319-75769-8 $2 doi
035 $a 978-3-319-75769-8
040 $a GP $c GP
041 0 $a eng
050 4 $a TK7888.4 $b .Y393 2018
072 7 $a TJFC $2 bicssc
072 7 $a TEC008010 $2 bisacsh
082 0 4 $a 620.11 $2 23
090 $a TK7888.4 $b .Y35 2018
100 1 $a Yazdani, Farhang. $3 1202456
245 1 0 $a Foundations of heterogeneous integration $h [electronic resource] : $b an industry-based, 2.5D/3D pathfinding and co-design approach / $c by Farhang Yazdani.
260 $a Cham : $c 2018. $b Springer International Publishing : $b Imprint: Springer,
300 $a x, 177 p. : $b ill. (some col.), digital ; $c 24 cm.
505 0 $a Introduction -- Wirebond Physical Implementation -- Flip-Chip Physical Implementation -- Substrate Physical Implementation -- Conventional Design Flow -- Pathfinding and Co-Design.
520 $a This book provides a practical, hands-on approach to teach the foundation of 2.5D/3D heterogeneous design. Based on the author's extensive, industrial experience, this book enables integrated circuit design techniques that provide more memory to the logic chip, also allowing for mixing chips and intellectual property blocks from any vendor to build a more complex chip, more efficiently and cost effectively. Various practical examples and industrial projects are presented throughout the book, including questions and term projects at the end of each chapter. This book is a great resource for practicing engineers and can be used at universities to teach a course at the senior undergraduate and graduate level. Provides knowledge and skills necessary to design wirebond, flip chip and system in package (SIP) products; Provides practical solutions for 2.5D/3D memory and logic integration, explaining a complex, multidisciplinary topic in straightforward terms; Demonstrates a unique co-design methodology for optimizing cross domain heterogeneous integration, including examples, pathfinding, packaging strategy, interposer structure, etc.; Includes real, industry-based examples to give readers hands-on practical design experience.
650 0 $a Engineering. $3 561152
650 0 $a Electronic circuits. $3 563332
650 0 $a Electronics. $3 596389
650 0 $a Microelectronics. $3 554956
650 2 4 $a Circuits and Systems. $3 670901
650 2 4 $a Electronic Circuits and Devices. $3 782968
650 2 4 $a Electronics and Microelectronics, Instrumentation. $3 670219
710 2 $a SpringerLink (Online service) $3 593884
773 0 $t Springer eBooks
856 4 0 $u http://dx.doi.org/10.1007/978-3-319-75769-8
950 $a Engineering (Springer-11647)