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3D IC and RF SiPs : = advanced stack...

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Hwang, Lih-Tyng.

3D IC and RF SiPs : = advanced stacking and planar solutions for 5G mobility /

紀錄類型:	書目-語言資料,印刷品 : Monograph/item
正題名/作者:	3D IC and RF SiPs :/ Lih-Tyng Hwang and Tzyy-Sheng Jason Horng.
其他題名:	advanced stacking and planar solutions for 5G mobility /
作者:	Hwang, Lih-Tyng.
其他作者:	Horng, Tzyy-sheng Jason.
出版者:	Hoboken, NJ :John Wiley & Sons, : c2018.,
面頁冊數:	xxxv, 425 p. :ill. ; : 25 cm.;
標題:	Mobile communication systems - Technological innovations. -
ISBN:	9781119289647 :

3D IC and RF SiPs : = advanced stacking and planar solutions for 5G mobility /
Hwang, Lih-Tyng.

3D IC and RF SiPs :advanced stacking and planar solutions for 5G mobility /Lih-Tyng Hwang and Tzyy-Sheng Jason Horng. - Hoboken, NJ :John Wiley & Sons,c2018. - xxxv, 425 p. :ill. ;25 cm.

Includes bibliographical references and index.

ISBN: 9781119289647 :NT4123

LCCN: 2017052146Subjects--Topical Terms:

833045
Mobile communication systems
--Technological innovations.

LC Class. No.: TK5103.2 / .H93 2018

Dewey Class. No.: 621.39/5

3D IC and RF SiPs : = advanced stacking and planar solutions for 5G mobility /
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020 $a 9781119289678 (pdf)
020 $a 9781119289661 (epub)
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245 1 0 $a 3D IC and RF SiPs : $b advanced stacking and planar solutions for 5G mobility / $c Lih-Tyng Hwang and Tzyy-Sheng Jason Horng.
260 # $a Hoboken, NJ : $b John Wiley & Sons, $c c2018.
300 $a xxxv, 425 p. : $b ill. ; $c 25 cm.
504 $a Includes bibliographical references and index.
650 # 0 $a Mobile communication systems $x Technological innovations. $3 833045
700 1 # $a Horng, Tzyy-sheng Jason. $3 1178531

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