3D IC and RF SiPs : = advanced stack...
Hwang, Lih-Tyng.

 

  • 3D IC and RF SiPs : = advanced stacking and planar solutions for 5G mobility /
  • Record Type: Language materials, printed : Monograph/item
    Title/Author: 3D IC and RF SiPs :/ Lih-Tyng Hwang and Tzyy-Sheng Jason Horng.
    Reminder of title: advanced stacking and planar solutions for 5G mobility /
    Author: Hwang, Lih-Tyng.
    other author: Horng, Tzyy-sheng Jason.
    Published: Hoboken, NJ :John Wiley & Sons, : c2018.,
    Description: xxxv, 425 p. :ill. ; : 25 cm.;
    Subject: Mobile communication systems - Technological innovations. -
    ISBN: 9781119289647 :
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  • 1 records • Pages 1 •
 
E046361 圖書館3F 書庫 一般圖書(BOOK) 一般圖書 621.395 H991 2018 一般使用(Normal) On shelf 0
  • 1 records • Pages 1 •
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