國立虎尾科技大學 |

Language: English

Back

Modeling and application of flexible...

Wan, Xiaodong.

Modeling and application of flexible electronics packaging

Record Type:	Language materials, printed : Monograph/item
Title/Author:	Modeling and application of flexible electronics packaging/ by YongAn Huang, Zhouping Yin, Xiaodong Wan.
Author:	Huang, YongAn.
other author:	Yin, Zhouping.
Published:	Singapore :Springer Singapore : : 2019.,
Description:	xvii, 287 p. :ill., digital ; : 24 cm.;
Contained By:	Springer eBooks
Subject:	Flexible electronics. -
Online resource:	https://doi.org/10.1007/978-981-13-3627-0
ISBN:	9789811336270

Modeling and application of flexible electronics packaging
Huang, YongAn.

Modeling and application of flexible electronics packaging[electronic resource] /by YongAn Huang, Zhouping Yin, Xiaodong Wan. - Singapore :Springer Singapore :2019. - xvii, 287 p. :ill., digital ;24 cm.

Advanced Electronics Packaging -- Interfacial Modeling of Flexible Multilayer Structures -- Measurement of Strength of Ultra-Thin Silicon Chip and Interfacial Fracture Energy -- Shear-Assisted Peeling -- Single-Needle Peeling -- Multi-Needle Peeling -- Conformal Peeling -- Laser Lift-Off -- Vacuum-Based Picking-up and Placing-on.

This book systematically discusses the modeling and application of transfer manipulation for flexible electronics packaging, presenting multiple processes according to the geometric sizes of the chips and devices as well as the detailed modeling and computation steps for each process. It also illustrates the experimental design of the equipment to help readers easily learn how to use it. This book is a valuable resource for scholars and graduate students in the research field of microelectronics.

ISBN: 9789811336270

Standard No.: 10.1007/978-981-13-3627-0doiSubjects--Topical Terms:

1080550
Flexible electronics.

LC Class. No.: TK7872.F54 / H836 2019

Dewey Class. No.: 621.381

Modeling and application of flexible electronics packaging
LDR:01830nam a2200325 a 4500 001 939709
003 DE-He213
005 20191004085555.0
006 m d
007 cr nn 008maaau
008 200414s2019 si s 0 eng d
020 $a 9789811336270 $q (electronic bk.)
020 $a 9789811336263 $q (paper)
024 7 $a 10.1007/978-981-13-3627-0 $2 doi
035 $a 978-981-13-3627-0
040 $a GP $c GP
041 0 $a eng
050 4 $a TK7872.F54 $b H836 2019
072 7 $a TJF $2 bicssc
072 7 $a TEC008000 $2 bisacsh
072 7 $a TJF $2 thema
082 0 4 $a 621.381 $2 23
090 $a TK7872.F54 $b H874 2019
100 1 $a Huang, YongAn. $3 1199865
245 1 0 $a Modeling and application of flexible electronics packaging $h [electronic resource] / $c by YongAn Huang, Zhouping Yin, Xiaodong Wan.
260 $a Singapore : $c 2019. $b Springer Singapore : $b Imprint: Springer,
300 $a xvii, 287 p. : $b ill., digital ; $c 24 cm.
505 0 $a Advanced Electronics Packaging -- Interfacial Modeling of Flexible Multilayer Structures -- Measurement of Strength of Ultra-Thin Silicon Chip and Interfacial Fracture Energy -- Shear-Assisted Peeling -- Single-Needle Peeling -- Multi-Needle Peeling -- Conformal Peeling -- Laser Lift-Off -- Vacuum-Based Picking-up and Placing-on.
520 $a This book systematically discusses the modeling and application of transfer manipulation for flexible electronics packaging, presenting multiple processes according to the geometric sizes of the chips and devices as well as the detailed modeling and computation steps for each process. It also illustrates the experimental design of the equipment to help readers easily learn how to use it. This book is a valuable resource for scholars and graduate students in the research field of microelectronics.
650 0 $a Flexible electronics. $3 1080550
650 1 4 $a Electronics and Microelectronics, Instrumentation. $3 670219
650 2 4 $a Optical and Electronic Materials. $3 593919
650 2 4 $a Manufacturing, Machines, Tools, Processes. $3 1226012
650 2 4 $a Theoretical and Applied Mechanics. $3 670861
650 2 4 $a Simulation and Modeling. $3 669249
700 1 $a Yin, Zhouping. $3 1226010
700 1 $a Wan, Xiaodong. $3 1226011
710 2 $a SpringerLink (Online service) $3 593884
773 0 $t Springer eBooks
856 4 0 $u https://doi.org/10.1007/978-981-13-3627-0
950 $a Engineering (Springer-11647)

based on 0 review(s)

Multimedia

Reviews

Add a review and share your thoughts with other readers

Export

pickup library