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Thermal Design of Liquid Cooled Micr...
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The American Society of Mechanical Engineers,
Thermal Design of Liquid Cooled Microelectronic Equipment : = Thermal Solutions, Analysis Methods, and Desing Practices /
紀錄類型:
書目-語言資料,印刷品 : Monograph/item
正題名/作者:
Thermal Design of Liquid Cooled Microelectronic Equipment :/ Lian-Tuu Yeh.
其他題名:
Thermal Solutions, Analysis Methods, and Desing Practices /
作者:
Yeh, Lian-Tuu,
面頁冊數:
1 online resource (350 pages) :illustrations. :
標題:
Electronic apparatus and appliances - Cooling. -
電子資源:
https://asmedigitalcollection.asme.org/ebooks/book/241/Thermal-Design-of-Liquid-Cooled-Microelectronic
ISBN:
9780791861936 (e-ISBN)
Thermal Design of Liquid Cooled Microelectronic Equipment : = Thermal Solutions, Analysis Methods, and Desing Practices /
Yeh, Lian-Tuu,1944-,
Thermal Design of Liquid Cooled Microelectronic Equipment :
Thermal Solutions, Analysis Methods, and Desing Practices /Lian-Tuu Yeh. - 1 online resource (350 pages) :illustrations.
Includes bibliographical references and index.
Front Matter -- 1. Introduction -- 2. Fundamentals of Convective and Boiling Heat Transfer -- 3. Key Components of Liquid Cooled Systems -- 4. Heat Transfer from Components to Coolant -- 5. Liquid Cooling Technologies -- 6. Two-Phase Heat Transfer Devices -- 7. Liquid Cooled Microelectronic Equipment -- 8. Thermal Design Guide of Liquid Cooled Systems -- Back Matter.
Restricted to subscribers or individual electronic text purchasers.
This book places a great deal of emphasis on providing practical solutions to thermal issues related to high power systems where liquid cooling is required. The book serves as a general thermal design guide for any liquid cooled systems with the main focus on microelectronic equipment that includes digital and/or analog devices. This book provides a comprehensive review and overview of all liquid cooling technologies as well as their applications to commercial products in industry. To facilitate design and analysis, the most commonly used correlations for the friction factor and heat transfer coefficient with either single phase liquid or two phase flow are summarized in the book. The general guidelines for thermal design of liquid cooled systems along with a step-by-step thermal analysis and design procedure are presented for liquid cooled systems with or without boiling. To meet the needs in telecommunication industry in which no liquid cooled rack is currently available commercially, a detailed system thermal design of liquid cooled telecommunication equipment is made, and two thermal design options based on open loop and closed loop cooling schemes, respectively are presented. Furthermore, the cooling solutions and design procedures discussed here can readily and easily be applied to any systems in other industries.
Electronic reproduction.
New York, N.Y. :
The American Society of Mechanical Engineers,
2019.
Mode of access: World Wide Web.
System requirements: Adobe Acrobat Reader.
In English.
ISBN: 9780791861936 (e-ISBN)
Standard No.: 10.1115/1.861936 doi
Publisher. No.: 861936asme
ASME, Two Park Avenue. New York, NY 10016
LCCN: 2019020787Subjects--Topical Terms:
886075
Electronic apparatus and appliances
--Cooling.Index Terms--Genre/Form:
554714
Electronic books.
LC Class. No.: TK7870.25
Dewey Class. No.: 621.381
Thermal Design of Liquid Cooled Microelectronic Equipment : = Thermal Solutions, Analysis Methods, and Desing Practices /
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ENG
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