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Packaging of High Power Semiconducto...
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SpringerLink (Online service)
Packaging of High Power Semiconductor Lasers
紀錄類型:
書目-語言資料,印刷品 : Monograph/item
正題名/作者:
Packaging of High Power Semiconductor Lasers/ by Xingsheng Liu, Wei Zhao, Lingling Xiong, Hui Liu.
作者:
Liu, Xingsheng.
其他作者:
Zhao, Wei.
面頁冊數:
XV, 402 p. 497 illus., 386 illus. in color.online resource. :
Contained By:
Springer Nature eBook
標題:
Energy systems. -
電子資源:
https://doi.org/10.1007/978-1-4614-9263-4
ISBN:
9781461492634
Packaging of High Power Semiconductor Lasers
Liu, Xingsheng.
Packaging of High Power Semiconductor Lasers
[electronic resource] /by Xingsheng Liu, Wei Zhao, Lingling Xiong, Hui Liu. - 1st ed. 2015. - XV, 402 p. 497 illus., 386 illus. in color.online resource. - Micro- and Opto-Electronic Materials, Structures, and Systems,2626-2371. - Micro- and Opto-Electronic Materials, Structures, and Systems,.
Introduction of High Power Semiconductor Lasers -- Overview of High Power Semiconductor Laser Packages -- Thermal Design and Management in High Power Semiconductor Laser Packaging -- Thermal Stress in High Power Semiconductor Lasers -- Optical Design and Beam Shaping in High Power Semiconductor Lasers -- Materials and Components in High Power Semiconductor Laser Packaging -- Packaging Process of High Power Semiconductor Lasers -- Testing and Characterization of High Power Semiconductor Lasers -- Failure Analysis and Reliability Assessment in High Power Semiconductor Laser Packaging -- Applications of High Power Semiconductor Lasers -- Development Trend and Challenges in High Power Semiconductor Laser Packaging.
This book introduces high power semiconductor laser packaging design. The characteristics and challenges of the design and various packaging, processing, and testing techniques are detailed by the authors. New technologies, in particular thermal technologies, current applications, and trends in high power semiconductor laser packaging are described at length and assessed.
ISBN: 9781461492634
Standard No.: 10.1007/978-1-4614-9263-4doiSubjects--Topical Terms:
1253529
Energy systems.
LC Class. No.: TK1001-1841
Dewey Class. No.: 621.042
Packaging of High Power Semiconductor Lasers
LDR
:02529nam a22004095i 4500
001
960461
003
DE-He213
005
20200630072419.0
007
cr nn 008mamaa
008
201211s2015 xxu| s |||| 0|eng d
020
$a
9781461492634
$9
978-1-4614-9263-4
024
7
$a
10.1007/978-1-4614-9263-4
$2
doi
035
$a
978-1-4614-9263-4
050
4
$a
TK1001-1841
072
7
$a
TH
$2
bicssc
072
7
$a
TEC031000
$2
bisacsh
072
7
$a
TH
$2
thema
082
0 4
$a
621.042
$2
23
100
1
$a
Liu, Xingsheng.
$4
aut
$4
http://id.loc.gov/vocabulary/relators/aut
$3
1062262
245
1 0
$a
Packaging of High Power Semiconductor Lasers
$h
[electronic resource] /
$c
by Xingsheng Liu, Wei Zhao, Lingling Xiong, Hui Liu.
250
$a
1st ed. 2015.
264
1
$a
New York, NY :
$b
Springer New York :
$b
Imprint: Springer,
$c
2015.
300
$a
XV, 402 p. 497 illus., 386 illus. in color.
$b
online resource.
336
$a
text
$b
txt
$2
rdacontent
337
$a
computer
$b
c
$2
rdamedia
338
$a
online resource
$b
cr
$2
rdacarrier
347
$a
text file
$b
PDF
$2
rda
490
1
$a
Micro- and Opto-Electronic Materials, Structures, and Systems,
$x
2626-2371
505
0
$a
Introduction of High Power Semiconductor Lasers -- Overview of High Power Semiconductor Laser Packages -- Thermal Design and Management in High Power Semiconductor Laser Packaging -- Thermal Stress in High Power Semiconductor Lasers -- Optical Design and Beam Shaping in High Power Semiconductor Lasers -- Materials and Components in High Power Semiconductor Laser Packaging -- Packaging Process of High Power Semiconductor Lasers -- Testing and Characterization of High Power Semiconductor Lasers -- Failure Analysis and Reliability Assessment in High Power Semiconductor Laser Packaging -- Applications of High Power Semiconductor Lasers -- Development Trend and Challenges in High Power Semiconductor Laser Packaging.
520
$a
This book introduces high power semiconductor laser packaging design. The characteristics and challenges of the design and various packaging, processing, and testing techniques are detailed by the authors. New technologies, in particular thermal technologies, current applications, and trends in high power semiconductor laser packaging are described at length and assessed.
650
0
$a
Energy systems.
$3
1253529
650
1 4
$a
Energy Systems.
$3
785876
700
1
$a
Zhao, Wei.
$4
aut
$4
http://id.loc.gov/vocabulary/relators/aut
$3
675389
700
1
$a
Xiong, Lingling.
$e
author.
$4
aut
$4
http://id.loc.gov/vocabulary/relators/aut
$3
1254430
700
1
$a
Liu, Hui.
$4
aut
$4
http://id.loc.gov/vocabulary/relators/aut
$3
1063190
710
2
$a
SpringerLink (Online service)
$3
593884
773
0
$t
Springer Nature eBook
776
0 8
$i
Printed edition:
$z
9781461492627
776
0 8
$i
Printed edition:
$z
9781461492641
776
0 8
$i
Printed edition:
$z
9781493955909
830
0
$a
Micro- and Opto-Electronic Materials, Structures, and Systems,
$x
2626-2371
$3
1254431
856
4 0
$u
https://doi.org/10.1007/978-1-4614-9263-4
912
$a
ZDB-2-ENE
912
$a
ZDB-2-SXEN
950
$a
Energy (SpringerNature-40367)
950
$a
Energy (R0) (SpringerNature-43717)
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