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Packaging of High Power Semiconducto...
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SpringerLink (Online service)
Packaging of High Power Semiconductor Lasers
Record Type:
Language materials, printed : Monograph/item
Title/Author:
Packaging of High Power Semiconductor Lasers/ by Xingsheng Liu, Wei Zhao, Lingling Xiong, Hui Liu.
Author:
Liu, Xingsheng.
other author:
Zhao, Wei.
Description:
XV, 402 p. 497 illus., 386 illus. in color.online resource. :
Contained By:
Springer Nature eBook
Subject:
Energy systems. -
Online resource:
https://doi.org/10.1007/978-1-4614-9263-4
ISBN:
9781461492634
Packaging of High Power Semiconductor Lasers
Liu, Xingsheng.
Packaging of High Power Semiconductor Lasers
[electronic resource] /by Xingsheng Liu, Wei Zhao, Lingling Xiong, Hui Liu. - 1st ed. 2015. - XV, 402 p. 497 illus., 386 illus. in color.online resource. - Micro- and Opto-Electronic Materials, Structures, and Systems,2626-2371. - Micro- and Opto-Electronic Materials, Structures, and Systems,.
Introduction of High Power Semiconductor Lasers -- Overview of High Power Semiconductor Laser Packages -- Thermal Design and Management in High Power Semiconductor Laser Packaging -- Thermal Stress in High Power Semiconductor Lasers -- Optical Design and Beam Shaping in High Power Semiconductor Lasers -- Materials and Components in High Power Semiconductor Laser Packaging -- Packaging Process of High Power Semiconductor Lasers -- Testing and Characterization of High Power Semiconductor Lasers -- Failure Analysis and Reliability Assessment in High Power Semiconductor Laser Packaging -- Applications of High Power Semiconductor Lasers -- Development Trend and Challenges in High Power Semiconductor Laser Packaging.
This book introduces high power semiconductor laser packaging design. The characteristics and challenges of the design and various packaging, processing, and testing techniques are detailed by the authors. New technologies, in particular thermal technologies, current applications, and trends in high power semiconductor laser packaging are described at length and assessed.
ISBN: 9781461492634
Standard No.: 10.1007/978-1-4614-9263-4doiSubjects--Topical Terms:
1253529
Energy systems.
LC Class. No.: TK1001-1841
Dewey Class. No.: 621.042
Packaging of High Power Semiconductor Lasers
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Introduction of High Power Semiconductor Lasers -- Overview of High Power Semiconductor Laser Packages -- Thermal Design and Management in High Power Semiconductor Laser Packaging -- Thermal Stress in High Power Semiconductor Lasers -- Optical Design and Beam Shaping in High Power Semiconductor Lasers -- Materials and Components in High Power Semiconductor Laser Packaging -- Packaging Process of High Power Semiconductor Lasers -- Testing and Characterization of High Power Semiconductor Lasers -- Failure Analysis and Reliability Assessment in High Power Semiconductor Laser Packaging -- Applications of High Power Semiconductor Lasers -- Development Trend and Challenges in High Power Semiconductor Laser Packaging.
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This book introduces high power semiconductor laser packaging design. The characteristics and challenges of the design and various packaging, processing, and testing techniques are detailed by the authors. New technologies, in particular thermal technologies, current applications, and trends in high power semiconductor laser packaging are described at length and assessed.
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