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Fundamentals of Lead-Free Solder Interconnect Technology = From Microstructures to Reliability /

Record Type:	Language materials, printed : Monograph/item
Title/Author:	Fundamentals of Lead-Free Solder Interconnect Technology/ by Tae-Kyu Lee, Thomas R. Bieler, Choong-Un Kim, Hongtao Ma.
Reminder of title:	From Microstructures to Reliability /
Author:	Lee, Tae-Kyu.
other author:	Bieler, Thomas R.
Description:	XIII, 253 p. 151 illus., 81 illus. in color.online resource. :
Contained By:	Springer Nature eBook
Subject:	Electronics. -
Online resource:	https://doi.org/10.1007/978-1-4614-9266-5
ISBN:	9781461492665

Fundamentals of Lead-Free Solder Interconnect Technology = From Microstructures to Reliability /
Lee, Tae-Kyu.

Fundamentals of Lead-Free Solder Interconnect TechnologyFrom Microstructures to Reliability /[electronic resource] :by Tae-Kyu Lee, Thomas R. Bieler, Choong-Un Kim, Hongtao Ma. - 1st ed. 2015. - XIII, 253 p. 151 illus., 81 illus. in color.online resource.

Introduction -- Interconnection : The Joint -- Phase Equilibria and Microstructure of Sn-Ag-Cu Alloys -- Microstructure Development; Solidification and Isothermal Aging -- Thermal Cycling Performance -- Mechanical Stability and Performance -- Chemical and Environment Attack -- Challenges in Future Generation Interconnects: Microstructure Again.

This unique book provides an up-to-date overview of the fundamental concepts behind lead-free solder and interconnection technology. Readers will find a description of the rapidly increasing presence of electronic systems in all aspects of modern life as well as the increasing need for predictable reliability in electronic systems. The physical and mechanical properties of lead-free solders are examined in detail, and building on fundamental science, the mechanisms responsible for damage and failure evolution, which affect reliability of lead-free solder joints are identified based on microstructure evolution. The continuing miniaturization of electronic systems will increase the demand on the performance of solder joints, which will require new alloy and processing strategies as well as interconnection design strategies. This book provides a foundation on which improved performance and new design approaches can be based. In summary, this book: Provides an up-to-date overview on lead-free soldering technologies Covers the fundamentals, implementation, reliability, challenges and risks of lead-free soldering technique Explores emerging technologies in lead-free soldering.

ISBN: 9781461492665

Standard No.: 10.1007/978-1-4614-9266-5doiSubjects--Topical Terms:

596389
Electronics.

LC Class. No.: TK7800-8360

Dewey Class. No.: 621.381

Fundamentals of Lead-Free Solder Interconnect Technology = From Microstructures to Reliability /
LDR:02980nam a22004095i 4500 001 969717
003 DE-He213
005 20200703014153.0
007 cr nn 008mamaa
008 201211s2015 xxu| s |||| 0|eng d
020 $a 9781461492665 $9 978-1-4614-9266-5
024 7 $a 10.1007/978-1-4614-9266-5 $2 doi
035 $a 978-1-4614-9266-5
050 4 $a TK7800-8360
050 4 $a TK7874-7874.9
072 7 $a TJF $2 bicssc
072 7 $a TEC008000 $2 bisacsh
072 7 $a TJF $2 thema
082 0 4 $a 621.381 $2 23
100 1 $a Lee, Tae-Kyu. $4 aut $4 http://id.loc.gov/vocabulary/relators/aut $3 1064103
245 1 0 $a Fundamentals of Lead-Free Solder Interconnect Technology $h [electronic resource] : $b From Microstructures to Reliability / $c by Tae-Kyu Lee, Thomas R. Bieler, Choong-Un Kim, Hongtao Ma.
250 $a 1st ed. 2015.
264 1 $a New York, NY : $b Springer US : $b Imprint: Springer, $c 2015.
300 $a XIII, 253 p. 151 illus., 81 illus. in color. $b online resource.
336 $a text $b txt $2 rdacontent
337 $a computer $b c $2 rdamedia
338 $a online resource $b cr $2 rdacarrier
347 $a text file $b PDF $2 rda
505 0 $a Introduction -- Interconnection : The Joint -- Phase Equilibria and Microstructure of Sn-Ag-Cu Alloys -- Microstructure Development; Solidification and Isothermal Aging -- Thermal Cycling Performance -- Mechanical Stability and Performance -- Chemical and Environment Attack -- Challenges in Future Generation Interconnects: Microstructure Again.
520 $a This unique book provides an up-to-date overview of the fundamental concepts behind lead-free solder and interconnection technology. Readers will find a description of the rapidly increasing presence of electronic systems in all aspects of modern life as well as the increasing need for predictable reliability in electronic systems. The physical and mechanical properties of lead-free solders are examined in detail, and building on fundamental science, the mechanisms responsible for damage and failure evolution, which affect reliability of lead-free solder joints are identified based on microstructure evolution. The continuing miniaturization of electronic systems will increase the demand on the performance of solder joints, which will require new alloy and processing strategies as well as interconnection design strategies. This book provides a foundation on which improved performance and new design approaches can be based. In summary, this book: Provides an up-to-date overview on lead-free soldering technologies Covers the fundamentals, implementation, reliability, challenges and risks of lead-free soldering technique Explores emerging technologies in lead-free soldering.
650 0 $a Electronics. $3 596389
650 0 $a Microelectronics. $3 554956
650 0 $a Optical materials. $3 672695
650 0 $a Electronic materials. $3 1253592
650 0 $a Electronic circuits. $3 563332
650 1 4 $a Electronics and Microelectronics, Instrumentation. $3 670219
650 2 4 $a Optical and Electronic Materials. $3 593919
650 2 4 $a Circuits and Systems. $3 670901
700 1 $a Bieler, Thomas R. $e author. $4 aut $4 http://id.loc.gov/vocabulary/relators/aut $3 1265272
700 1 $a Kim, Choong-Un. $4 aut $4 http://id.loc.gov/vocabulary/relators/aut $3 1029672
700 1 $a Ma, Hongtao. $e author. $4 aut $4 http://id.loc.gov/vocabulary/relators/aut $3 1265273
710 2 $a SpringerLink (Online service) $3 593884
773 0 $t Springer Nature eBook
776 0 8 $i Printed edition: $z 9781461492658
776 0 8 $i Printed edition: $z 9781461492672
776 0 8 $i Printed edition: $z 9781489978011
856 4 0 $u https://doi.org/10.1007/978-1-4614-9266-5
912 $a ZDB-2-ENG
912 $a ZDB-2-SXE
950 $a Engineering (SpringerNature-11647)
950 $a Engineering (R0) (SpringerNature-43712)