國立虎尾科技大學 |

Molecular Modeling and Multiscaling Issues for Electronic Material Applications = Volume 2 /

紀錄類型:	書目-語言資料,印刷品 : Monograph/item
正題名/作者:	Molecular Modeling and Multiscaling Issues for Electronic Material Applications/ edited by Artur Wymyslowski, Nancy Iwamoto, Matthew Yuen, Haibo Fan.
其他題名:	Volume 2 /
其他作者:	Wymyslowski, Artur.
面頁冊數:	X, 194 p. 153 illus., 77 illus. in color.online resource. :
Contained By:	Springer Nature eBook
標題:	Electronics. -
電子資源:	https://doi.org/10.1007/978-3-319-12862-7
ISBN:	9783319128627

Molecular Modeling and Multiscaling Issues for Electronic Material Applications = Volume 2 /
Molecular Modeling and Multiscaling Issues for Electronic Material ApplicationsVolume 2 /[electronic resource] :edited by Artur Wymyslowski, Nancy Iwamoto, Matthew Yuen, Haibo Fan. - 1st ed. 2015. - X, 194 p. 153 illus., 77 illus. in color.online resource.

Molecular Modeling of pH-Dependent Properties of Emeraldine Base Polyaniline for pH-Based Chemical Sensors -- Two Approaches of Study Cu/Epoxy Interface Enhancement with Benzenethiol Promoter -- Molecular Dynamics Simulation of Pore Formation Mechanism for Deposition of Poly (vinylidene fluoride-co-trifluoroethylene) on Gold Substrate -- Investigating the Influence of Moisture by Molecular Dynamics Simulations -- Analysis of the Adhesion Work with a Molecular Modeling Method and a Wetting Angle Measurement -- Using Coarse-Grained Molecular Models (Molecular-Mesocale) of a Copper Oxide-Epoxy Interface to Obtain Stress-Strain Failure Predictions which Include Interfacial Roughness, Water and Filler Effects -- Establishment of the Mesoscale Parameters for Separation: A Non-Equilibrium Molecular Dynamics Model -- Mechanics of Graphene and Carbon Nanotubes under Uniaxial Compression and Tension -- Analysis of an Influence of a Conversion Level on Simulation Results of the Crosslinked Polymers.

This book offers readers a snapshot of the progression of molecular modeling in the electronics industry and how molecular modeling is currently being used to understand materials to solve relevant issues in this field. The reader is introduced to the evolving role of molecular modeling, especially seen from the perspective of the IEEE community and modeling in electronics. This book also covers the aspects of molecular modeling needed to understand the relationship between structures and mechanical performance of materials. The authors also discuss the transitional topic of multiscale modeling and recent developments on the atomistic scale and current attempts to reach the submicron scale, as well as the role that quantum mechanics can play in performance prediction. This book also: Discusses multiscale modeling of materials at the mesoscale Highlights current state-of-the-art, novel research topics and achievements in the area of molecular modelling and multiscaling problems of electronic materials and their applications as well as atomistic modeling of mechanical properties Provides practical examples for engineers interested in molecular modeling using simulations drawn from electronic packaging, dielectric materials, and thermal and mechanical properties.

ISBN: 9783319128627

Standard No.: 10.1007/978-3-319-12862-7doiSubjects--Topical Terms:

596389
Electronics.

LC Class. No.: TK7800-8360

Dewey Class. No.: 621.381

Molecular Modeling and Multiscaling Issues for Electronic Material Applications = Volume 2 /
LDR:03734nam a22004095i 4500 001 970087
003 DE-He213
005 20200704165343.0
007 cr nn 008mamaa
008 201211s2015 gw | s |||| 0|eng d
020 $a 9783319128627 $9 978-3-319-12862-7
024 7 $a 10.1007/978-3-319-12862-7 $2 doi
035 $a 978-3-319-12862-7
050 4 $a TK7800-8360
050 4 $a TK7874-7874.9
072 7 $a TJF $2 bicssc
072 7 $a TEC008000 $2 bisacsh
072 7 $a TJF $2 thema
082 0 4 $a 621.381 $2 23
245 1 0 $a Molecular Modeling and Multiscaling Issues for Electronic Material Applications $h [electronic resource] : $b Volume 2 / $c edited by Artur Wymyslowski, Nancy Iwamoto, Matthew Yuen, Haibo Fan.
250 $a 1st ed. 2015.
264 1 $a Cham : $b Springer International Publishing : $b Imprint: Springer, $c 2015.
300 $a X, 194 p. 153 illus., 77 illus. in color. $b online resource.
336 $a text $b txt $2 rdacontent
337 $a computer $b c $2 rdamedia
338 $a online resource $b cr $2 rdacarrier
347 $a text file $b PDF $2 rda
505 0 $a Molecular Modeling of pH-Dependent Properties of Emeraldine Base Polyaniline for pH-Based Chemical Sensors -- Two Approaches of Study Cu/Epoxy Interface Enhancement with Benzenethiol Promoter -- Molecular Dynamics Simulation of Pore Formation Mechanism for Deposition of Poly (vinylidene fluoride-co-trifluoroethylene) on Gold Substrate -- Investigating the Influence of Moisture by Molecular Dynamics Simulations -- Analysis of the Adhesion Work with a Molecular Modeling Method and a Wetting Angle Measurement -- Using Coarse-Grained Molecular Models (Molecular-Mesocale) of a Copper Oxide-Epoxy Interface to Obtain Stress-Strain Failure Predictions which Include Interfacial Roughness, Water and Filler Effects -- Establishment of the Mesoscale Parameters for Separation: A Non-Equilibrium Molecular Dynamics Model -- Mechanics of Graphene and Carbon Nanotubes under Uniaxial Compression and Tension -- Analysis of an Influence of a Conversion Level on Simulation Results of the Crosslinked Polymers.
520 $a This book offers readers a snapshot of the progression of molecular modeling in the electronics industry and how molecular modeling is currently being used to understand materials to solve relevant issues in this field. The reader is introduced to the evolving role of molecular modeling, especially seen from the perspective of the IEEE community and modeling in electronics. This book also covers the aspects of molecular modeling needed to understand the relationship between structures and mechanical performance of materials. The authors also discuss the transitional topic of multiscale modeling and recent developments on the atomistic scale and current attempts to reach the submicron scale, as well as the role that quantum mechanics can play in performance prediction. This book also: Discusses multiscale modeling of materials at the mesoscale Highlights current state-of-the-art, novel research topics and achievements in the area of molecular modelling and multiscaling problems of electronic materials and their applications as well as atomistic modeling of mechanical properties Provides practical examples for engineers interested in molecular modeling using simulations drawn from electronic packaging, dielectric materials, and thermal and mechanical properties.
650 0 $a Electronics. $3 596389
650 0 $a Microelectronics. $3 554956
650 0 $a Mechanics. $3 527684
650 0 $a Mechanics, Applied. $3 596630
650 0 $a Optical materials. $3 672695
650 0 $a Electronic materials. $3 1253592
650 0 $a Nanoscale science. $3 1253587
650 0 $a Nanoscience. $3 632473
650 0 $a Nanostructures. $3 561754
650 1 4 $a Electronics and Microelectronics, Instrumentation. $3 670219
650 2 4 $a Solid Mechanics. $3 1211586
650 2 4 $a Optical and Electronic Materials. $3 593919
650 2 4 $a Nanoscale Science and Technology. $3 783795
700 1 $a Wymyslowski, Artur. $4 edt $4 http://id.loc.gov/vocabulary/relators/edt $3 1064189
700 1 $a Iwamoto, Nancy. $4 edt $4 http://id.loc.gov/vocabulary/relators/edt $3 889972
700 1 $a Yuen, Matthew. $e editor. $4 edt $4 http://id.loc.gov/vocabulary/relators/edt $3 1265673
700 1 $a Fan, Haibo. $4 edt $4 http://id.loc.gov/vocabulary/relators/edt $3 889974
710 2 $a SpringerLink (Online service) $3 593884
773 0 $t Springer Nature eBook
776 0 8 $i Printed edition: $z 9783319128610
776 0 8 $i Printed edition: $z 9783319128634
776 0 8 $i Printed edition: $z 9783319366661
856 4 0 $u https://doi.org/10.1007/978-3-319-12862-7
912 $a ZDB-2-ENG
912 $a ZDB-2-SXE
950 $a Engineering (SpringerNature-11647)
950 $a Engineering (R0) (SpringerNature-43712)