國立虎尾科技大學 |

Three-Dimensional Integration of Semiconductors = Processing, Materials, and Applications /

紀錄類型:	書目-語言資料,印刷品 : Monograph/item
正題名/作者:	Three-Dimensional Integration of Semiconductors/ edited by Kazuo Kondo, Morihiro Kada, Kenji Takahashi.
其他題名:	Processing, Materials, and Applications /
其他作者:	Kondo, Kazuo.
面頁冊數:	XIX, 408 p. 460 illus., 269 illus. in color.online resource. :
Contained By:	Springer Nature eBook
標題:	Electrochemistry. -
電子資源:	https://doi.org/10.1007/978-3-319-18675-7
ISBN:	9783319186757

Three-Dimensional Integration of Semiconductors = Processing, Materials, and Applications /
Three-Dimensional Integration of SemiconductorsProcessing, Materials, and Applications /[electronic resource] :edited by Kazuo Kondo, Morihiro Kada, Kenji Takahashi. - 1st ed. 2015. - XIX, 408 p. 460 illus., 269 illus. in color.online resource.

Research and Development History of Three Dimensional (3D) Integration Technology -- Recent Research and Development Activities of Three Dimensional (3D) Integration Technology -- TSV Processes -- Wafer and Die Bonding Processes -- Metrology and Inspection -- TSV Characteristics and Reliability: Impact of 3D Integration Processes on Device Reliability -- Trends in 3D Integrated Circuit (3D-IC) Testing Technology -- Dream Chip Project at ASET.

This book starts with background concerning three-dimensional integration - including their low energy consumption and high speed image processing - and then proceeds to how to construct them and which materials to use in particular situations. The book covers numerous applications, including next generation smart phones, driving assistance systems, capsule endoscopes, homing missiles, and many others. The book concludes with recent progress and developments in three dimensional packaging, as well as future prospects.

ISBN: 9783319186757

Standard No.: 10.1007/978-3-319-18675-7doiSubjects--Topical Terms:

591514
Electrochemistry.

LC Class. No.: QD551-578

Dewey Class. No.: 541.37

Three-Dimensional Integration of Semiconductors = Processing, Materials, and Applications /
LDR:02420nam a22003975i 4500 001 970613
003 DE-He213
005 20200630151837.0
007 cr nn 008mamaa
008 201211s2015 gw | s |||| 0|eng d
020 $a 9783319186757 $9 978-3-319-18675-7
024 7 $a 10.1007/978-3-319-18675-7 $2 doi
035 $a 978-3-319-18675-7
050 4 $a QD551-578
072 7 $a PNRH $2 bicssc
072 7 $a SCI013050 $2 bisacsh
072 7 $a PNRH $2 thema
082 0 4 $a 541.37 $2 23
245 1 0 $a Three-Dimensional Integration of Semiconductors $h [electronic resource] : $b Processing, Materials, and Applications / $c edited by Kazuo Kondo, Morihiro Kada, Kenji Takahashi.
250 $a 1st ed. 2015.
264 1 $a Cham : $b Springer International Publishing : $b Imprint: Springer, $c 2015.
300 $a XIX, 408 p. 460 illus., 269 illus. in color. $b online resource.
336 $a text $b txt $2 rdacontent
337 $a computer $b c $2 rdamedia
338 $a online resource $b cr $2 rdacarrier
347 $a text file $b PDF $2 rda
505 0 $a Research and Development History of Three Dimensional (3D) Integration Technology -- Recent Research and Development Activities of Three Dimensional (3D) Integration Technology -- TSV Processes -- Wafer and Die Bonding Processes -- Metrology and Inspection -- TSV Characteristics and Reliability: Impact of 3D Integration Processes on Device Reliability -- Trends in 3D Integrated Circuit (3D-IC) Testing Technology -- Dream Chip Project at ASET.
520 $a This book starts with background concerning three-dimensional integration - including their low energy consumption and high speed image processing - and then proceeds to how to construct them and which materials to use in particular situations. The book covers numerous applications, including next generation smart phones, driving assistance systems, capsule endoscopes, homing missiles, and many others. The book concludes with recent progress and developments in three dimensional packaging, as well as future prospects.
650 0 $a Electrochemistry. $3 591514
650 0 $a Electrical engineering. $3 596380
650 0 $a Semiconductors. $3 578843
650 0 $a Mechanical engineering. $3 557493
650 0 $a Biomedical engineering. $3 588770
650 2 4 $a Electrical Engineering. $3 768742
650 2 4 $a Mechanical Engineering. $3 670827
650 2 4 $a Biomedical Engineering and Bioengineering. $3 1211019
700 1 $a Kondo, Kazuo. $4 edt $4 http://id.loc.gov/vocabulary/relators/edt $3 1021931
700 1 $a Kada, Morihiro. $4 edt $4 http://id.loc.gov/vocabulary/relators/edt $3 1070283
700 1 $a Takahashi, Kenji. $4 edt $4 http://id.loc.gov/vocabulary/relators/edt $3 1070284
710 2 $a SpringerLink (Online service) $3 593884
773 0 $t Springer Nature eBook
776 0 8 $i Printed edition: $z 9783319186740
776 0 8 $i Printed edition: $z 9783319186764
776 0 8 $i Printed edition: $z 9783319792552
856 4 0 $u https://doi.org/10.1007/978-3-319-18675-7
912 $a ZDB-2-CMS
912 $a ZDB-2-SXC
950 $a Chemistry and Materials Science (SpringerNature-11644)
950 $a Chemistry and Material Science (R0) (SpringerNature-43709)