國立虎尾科技大學 |

Foundations of Heterogeneous Integration: An Industry-Based, 2.5D/3D Pathfinding and Co-Design Approach

紀錄類型:	書目-語言資料,印刷品 : Monograph/item
正題名/作者:	Foundations of Heterogeneous Integration: An Industry-Based, 2.5D/3D Pathfinding and Co-Design Approach/ by Farhang Yazdani.
作者:	Yazdani, Farhang.
面頁冊數:	X, 177 p. 155 illus., 152 illus. in color.online resource. :
Contained By:	Springer Nature eBook
標題:	Electronic circuits. -
電子資源:	https://doi.org/10.1007/978-3-319-75769-8
ISBN:	9783319757698

Foundations of Heterogeneous Integration: An Industry-Based, 2.5D/3D Pathfinding and Co-Design Approach
Yazdani, Farhang.

Foundations of Heterogeneous Integration: An Industry-Based, 2.5D/3D Pathfinding and Co-Design Approach[electronic resource] /by Farhang Yazdani. - 1st ed. 2018. - X, 177 p. 155 illus., 152 illus. in color.online resource.

Introduction -- Wirebond Physical Implementation -- Flip-Chip Physical Implementation -- Substrate Physical Implementation -- Conventional Design Flow -- Pathfinding and Co-Design.

This book provides a practical, hands-on approach to teach the foundation of 2.5D/3D heterogeneous design. Based on the author’s extensive, industrial experience, this book enables integrated circuit design techniques that provide more memory to the logic chip, also allowing for mixing chips and intellectual property blocks from any vendor to build a more complex chip, more efficiently and cost effectively. Various practical examples and industrial projects are presented throughout the book, including questions and term projects at the end of each chapter. This book is a great resource for practicing engineers and can be used at universities to teach a course at the senior undergraduate and graduate level. Provides knowledge and skills necessary to design wirebond, flip chip and system in package (SIP) products; Provides practical solutions for 2.5D/3D memory and logic integration, explaining a complex, multidisciplinary topic in straightforward terms; Demonstrates a unique co-design methodology for optimizing cross domain heterogeneous integration, including examples, pathfinding, packaging strategy, interposer structure, etc.; Includes real, industry-based examples to give readers hands-on practical design experience.

ISBN: 9783319757698

Standard No.: 10.1007/978-3-319-75769-8doiSubjects--Topical Terms:

563332
Electronic circuits.

LC Class. No.: TK7888.4

Dewey Class. No.: 621.3815

Foundations of Heterogeneous Integration: An Industry-Based, 2.5D/3D Pathfinding and Co-Design Approach
LDR:02806nam a22003975i 4500 001 988001
003 DE-He213
005 20200702152041.0
007 cr nn 008mamaa
008 201225s2018 gw | s |||| 0|eng d
020 $a 9783319757698 $9 978-3-319-75769-8
024 7 $a 10.1007/978-3-319-75769-8 $2 doi
035 $a 978-3-319-75769-8
050 4 $a TK7888.4
072 7 $a TJFC $2 bicssc
072 7 $a TEC008010 $2 bisacsh
072 7 $a TJFC $2 thema
082 0 4 $a 621.3815 $2 23
100 1 $a Yazdani, Farhang. $4 aut $4 http://id.loc.gov/vocabulary/relators/aut $3 1202456
245 1 0 $a Foundations of Heterogeneous Integration: An Industry-Based, 2.5D/3D Pathfinding and Co-Design Approach $h [electronic resource] / $c by Farhang Yazdani.
250 $a 1st ed. 2018.
264 1 $a Cham : $b Springer International Publishing : $b Imprint: Springer, $c 2018.
300 $a X, 177 p. 155 illus., 152 illus. in color. $b online resource.
336 $a text $b txt $2 rdacontent
337 $a computer $b c $2 rdamedia
338 $a online resource $b cr $2 rdacarrier
347 $a text file $b PDF $2 rda
505 0 $a Introduction -- Wirebond Physical Implementation -- Flip-Chip Physical Implementation -- Substrate Physical Implementation -- Conventional Design Flow -- Pathfinding and Co-Design.
520 $a This book provides a practical, hands-on approach to teach the foundation of 2.5D/3D heterogeneous design. Based on the author’s extensive, industrial experience, this book enables integrated circuit design techniques that provide more memory to the logic chip, also allowing for mixing chips and intellectual property blocks from any vendor to build a more complex chip, more efficiently and cost effectively. Various practical examples and industrial projects are presented throughout the book, including questions and term projects at the end of each chapter. This book is a great resource for practicing engineers and can be used at universities to teach a course at the senior undergraduate and graduate level. Provides knowledge and skills necessary to design wirebond, flip chip and system in package (SIP) products; Provides practical solutions for 2.5D/3D memory and logic integration, explaining a complex, multidisciplinary topic in straightforward terms; Demonstrates a unique co-design methodology for optimizing cross domain heterogeneous integration, including examples, pathfinding, packaging strategy, interposer structure, etc.; Includes real, industry-based examples to give readers hands-on practical design experience.
650 0 $a Electronic circuits. $3 563332
650 0 $a Electronics. $3 596389
650 0 $a Microelectronics. $3 554956
650 1 4 $a Circuits and Systems. $3 670901
650 2 4 $a Electronic Circuits and Devices. $3 782968
650 2 4 $a Electronics and Microelectronics, Instrumentation. $3 670219
710 2 $a SpringerLink (Online service) $3 593884
773 0 $t Springer Nature eBook
776 0 8 $i Printed edition: $z 9783319757674
776 0 8 $i Printed edition: $z 9783319757681
776 0 8 $i Printed edition: $z 9783030093235
856 4 0 $u https://doi.org/10.1007/978-3-319-75769-8
912 $a ZDB-2-ENG
912 $a ZDB-2-SXE
950 $a Engineering (SpringerNature-11647)
950 $a Engineering (R0) (SpringerNature-43712)