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Research on Chemical Mechanical Polishing Mechanism of Novel Diffusion Barrier Ru for Cu Interconnect
紀錄類型:
書目-語言資料,印刷品 : Monograph/item
正題名/作者:
Research on Chemical Mechanical Polishing Mechanism of Novel Diffusion Barrier Ru for Cu Interconnect / by Jie Cheng.
作者:
Cheng, Jie.
面頁冊數:
XVIII, 137 p. 103 illus.online resource. :
Contained By:
Springer Nature eBook
標題:
Manufactures. -
電子資源:
https://doi.org/10.1007/978-981-10-6165-3
ISBN:
9789811061653
Research on Chemical Mechanical Polishing Mechanism of Novel Diffusion Barrier Ru for Cu Interconnect
Cheng, Jie.
Research on Chemical Mechanical Polishing Mechanism of Novel Diffusion Barrier Ru for Cu Interconnect
[electronic resource] /by Jie Cheng. - 1st ed. 2018. - XVIII, 137 p. 103 illus.online resource. - Springer Theses, Recognizing Outstanding Ph.D. Research,2190-5053. - Springer Theses, Recognizing Outstanding Ph.D. Research,.
This thesis addresses selected unsolved problems in the chemical mechanical polishing process (CMP) for integrated circuits using ruthenium (Ru) as a novel barrier layer material. Pursuing a systematic approach to resolve the remaining critical issues in the CMP, it first investigates the tribocorrosion properties and the material removal mechanisms of copper (Cu) and Ru in KIO4-based slurry. The thesis subsequently studies Cu/Ru galvanic corrosion from a new micro and in-situ perspective, and on this basis, seeks ways to mitigate corrosion using different slurry additives. The findings presented here constitute a significant advance in fundamental and technical investigations into the CMP, while also laying the groundwork for future research.
ISBN: 9789811061653
Standard No.: 10.1007/978-981-10-6165-3doiSubjects--Topical Terms:
680602
Manufactures.
LC Class. No.: TS1-2301
Dewey Class. No.: 670
Research on Chemical Mechanical Polishing Mechanism of Novel Diffusion Barrier Ru for Cu Interconnect
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