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Systems-Level Packaging for Millimeter-Wave Transceivers

Record Type:	Language materials, printed : Monograph/item
Title/Author:	Systems-Level Packaging for Millimeter-Wave Transceivers/ by Mladen Božanić, Saurabh Sinha.
Author:	Božanić, Mladen.
other author:	Sinha, Saurabh.
Description:	XV, 277 p.online resource. :
Contained By:	Springer Nature eBook
Subject:	Wireless communication systems. -
Online resource:	https://doi.org/10.1007/978-3-030-14690-0
ISBN:	9783030146900

Systems-Level Packaging for Millimeter-Wave Transceivers
Božanić, Mladen.

Systems-Level Packaging for Millimeter-Wave Transceivers[electronic resource] /by Mladen Božanić, Saurabh Sinha. - 1st ed. 2019. - XV, 277 p.online resource. - Smart Sensors, Measurement and Instrumentation,342194-8402 ;. - Smart Sensors, Measurement and Instrumentation,12.

Introduction and Research Impact -- Millimeter-Wave Research Challenges.-Behavior of Active and Passive Devices at Millimeter-Wave Frequencies -- Integrated Substrates: Millimeter-Wave Transistor Technologies -- Discrete Substrates: Package Foundation -- Traditional Approach: System-on-Chip -- Multi-Chip Modules and Multi-Chip Packaging -- State-of-the-Art Approach: System-on-Package -- Evaluation of Research Questions, Remaining Research Gaps and Future Directions.

This book provides a system-level approach to making packaging decisions for millimeter-wave transceivers. In electronics, the packaging forms a bridge between the integrated circuit or individual device and the rest of the electronic system, encompassing all technologies between the two. To be able to make well-founded packaging decisions, researchers need to understand a broad range of aspects, including: concepts of transmission bands, antennas and propagation, integrated and discrete package substrates, materials and technologies, interconnects, passive and active components, as well as the advantages and disadvantages of various packages and packaging approaches, and package-level modeling and simulation. Packaging also needs to be considered in terms of system-level testing, as well as associated testing and production costs, and reducing costs. This peer-reviewed work contributes to the extant scholarly literature by addressing the aforementioned concepts and applying them to the context of the millimeter-wave regime and the unique opportunities that this transmission approach offers.

ISBN: 9783030146900

Standard No.: 10.1007/978-3-030-14690-0doiSubjects--Topical Terms:

562740
Wireless communication systems.

LC Class. No.: TK5103.2-.4885

Dewey Class. No.: 384.5

Systems-Level Packaging for Millimeter-Wave Transceivers
LDR:02984nam a22004095i 4500 001 1010528
003 DE-He213
005 20201221231652.0
007 cr nn 008mamaa
008 210106s2019 gw | s |||| 0|eng d
020 $a 9783030146900 $9 978-3-030-14690-0
024 7 $a 10.1007/978-3-030-14690-0 $2 doi
035 $a 978-3-030-14690-0
050 4 $a TK5103.2-.4885
072 7 $a TJKW $2 bicssc
072 7 $a TEC061000 $2 bisacsh
072 7 $a TJKW $2 thema
082 0 4 $a 384.5 $2 23
100 1 $a Božanić, Mladen. $e author. $4 aut $4 http://id.loc.gov/vocabulary/relators/aut $3 1273934
245 1 0 $a Systems-Level Packaging for Millimeter-Wave Transceivers $h [electronic resource] / $c by Mladen Božanić, Saurabh Sinha.
250 $a 1st ed. 2019.
264 1 $a Cham : $b Springer International Publishing : $b Imprint: Springer, $c 2019.
300 $a XV, 277 p. $b online resource.
336 $a text $b txt $2 rdacontent
337 $a computer $b c $2 rdamedia
338 $a online resource $b cr $2 rdacarrier
347 $a text file $b PDF $2 rda
490 1 $a Smart Sensors, Measurement and Instrumentation, $x 2194-8402 ; $v 34
505 0 $a Introduction and Research Impact -- Millimeter-Wave Research Challenges.-Behavior of Active and Passive Devices at Millimeter-Wave Frequencies -- Integrated Substrates: Millimeter-Wave Transistor Technologies -- Discrete Substrates: Package Foundation -- Traditional Approach: System-on-Chip -- Multi-Chip Modules and Multi-Chip Packaging -- State-of-the-Art Approach: System-on-Package -- Evaluation of Research Questions, Remaining Research Gaps and Future Directions.
520 $a This book provides a system-level approach to making packaging decisions for millimeter-wave transceivers. In electronics, the packaging forms a bridge between the integrated circuit or individual device and the rest of the electronic system, encompassing all technologies between the two. To be able to make well-founded packaging decisions, researchers need to understand a broad range of aspects, including: concepts of transmission bands, antennas and propagation, integrated and discrete package substrates, materials and technologies, interconnects, passive and active components, as well as the advantages and disadvantages of various packages and packaging approaches, and package-level modeling and simulation. Packaging also needs to be considered in terms of system-level testing, as well as associated testing and production costs, and reducing costs. This peer-reviewed work contributes to the extant scholarly literature by addressing the aforementioned concepts and applying them to the context of the millimeter-wave regime and the unique opportunities that this transmission approach offers.
650 0 $a Wireless communication systems. $3 562740
650 0 $a Mobile communication systems. $3 562917
650 0 $a Engineering design. $3 560518
650 0 $a Computer engineering. $3 569006
650 0 $a Internet of things. $3 1023130
650 0 $a Embedded computer systems. $3 562313
650 1 4 $a Wireless and Mobile Communication. $3 1207058
650 2 4 $a Engineering Design. $3 670857
650 2 4 $a Cyber-physical systems, IoT. $3 1226036
700 1 $a Sinha, Saurabh. $4 aut $4 http://id.loc.gov/vocabulary/relators/aut $3 1104131
710 2 $a SpringerLink (Online service) $3 593884
773 0 $t Springer Nature eBook
776 0 8 $i Printed edition: $z 9783030146894
776 0 8 $i Printed edition: $z 9783030146917
776 0 8 $i Printed edition: $z 9783030146924
830 0 $a Smart Sensors, Measurement and Instrumentation, $x 2194-8402 ; $v 12 $3 1256255
856 4 0 $u https://doi.org/10.1007/978-3-030-14690-0
912 $a ZDB-2-ENG
912 $a ZDB-2-SXE
950 $a Engineering (SpringerNature-11647)
950 $a Engineering (R0) (SpringerNature-43712)