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Proceedings of the Green Materials and Electronic Packaging Interconnect Technology Symposium = EPITS 2022, 14-15 September, Langkawi, Malaysia /

Record Type:	Language materials, printed : Monograph/item
Title/Author:	Proceedings of the Green Materials and Electronic Packaging Interconnect Technology Symposium/ edited by Mohd Arif Anuar Mohd Salleh ... [et al.].
Reminder of title:	EPITS 2022, 14-15 September, Langkawi, Malaysia /
remainder title:	EPITS 2022
other author:	Mohd Salleh, Mohd Arif Anuar.
corporate name:	Workshop on the Preservation of Stability under Discretization
Published:	Singapore :Springer Nature Singapore : : 2023.,
Description:	xli, 875 p. :ill. (some col.), digital ; : 24 cm.;
Contained By:	Springer Nature eBook
Subject:	Electronic packaging - Congresses. -
Online resource:	https://doi.org/10.1007/978-981-19-9267-4
ISBN:	9789811992674

Proceedings of the Green Materials and Electronic Packaging Interconnect Technology Symposium = EPITS 2022, 14-15 September, Langkawi, Malaysia /
Proceedings of the Green Materials and Electronic Packaging Interconnect Technology SymposiumEPITS 2022, 14-15 September, Langkawi, Malaysia /[electronic resource] :EPITS 2022edited by Mohd Arif Anuar Mohd Salleh ... [et al.]. - Singapore :Springer Nature Singapore :2023. - xli, 875 p. :ill. (some col.), digital ;24 cm. - Springer proceedings in physics,v. 2891867-4941 ;. - Springer proceedings in physics,v. 289..

Green Materials and Electronic Packaging Interconnect Technology -- Electronic Materials and Technology -- Green Materials and Technology.

This book presents peer reviewed articles from the Green Materials and Electronic Packaging Interconnect Technology Symposium, (EPITS 2022), held in Langkawi, Malaysia on 14th and 15th of Sept, 2022. It brings together packaging experts to share and exchange ideas in electronics technology. Topics covered in this volume include, but are not limited to; (1) Green materials and technology, (2) Emerging interconnect materials and technologies,(3) Non-solder interconnect materials at chip and package levels, (4) Fundamental materials behavior for electronic packaging materials, (5) Advanced characterization methods as applied to electronic packaging technology, (6) Developments in high temperature Pb-free solders and associated interconnects for automotive and power electronics, (7) Surface coating materials & (8) Advanced materials.

ISBN: 9789811992674

Standard No.: 10.1007/978-981-19-9267-4doiSubjects--Topical Terms:

882979
Electronic packaging
--Congresses.

LC Class. No.: TK7870.15

Dewey Class. No.: 621.381046

Proceedings of the Green Materials and Electronic Packaging Interconnect Technology Symposium = EPITS 2022, 14-15 September, Langkawi, Malaysia /
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