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Electrical modeling and design for 3...

Li, Er-Ping.

Electrical modeling and design for 3D system integration = 3D integrated circuits and packaging, signal integrity, power integrity and EMC /

Record Type:	Language materials, printed : Monograph/item
Title/Author:	Electrical modeling and design for 3D system integration/ Er-Ping Li.
Reminder of title:	3D integrated circuits and packaging, signal integrity, power integrity and EMC /
Author:	Li, Er-Ping.
Published:	[United States] :IEEE Press ; : c2012.,
Description:	1 online resource.
Notes:	Includes index.
Subject:	Three-dimensional integrated circuits. -
Online resource:	http://ieeexplore.ieee.org/xpl/bkabstractplus.jsp?bkn=6183551
ISBN:	9781118166727 (electronic bk.)

Electrical modeling and design for 3D system integration = 3D integrated circuits and packaging, signal integrity, power integrity and EMC /
Li, Er-Ping.

Electrical modeling and design for 3D system integration3D integrated circuits and packaging, signal integrity, power integrity and EMC /[electronic resource] :Er-Ping Li. - [United States] :IEEE Press ;c2012. - 1 online resource.

Includes index.

Includes bibliographical references and index.

Macromodeling of Complex Interconnects in 3D Integration --

ISBN: 9781118166727 (electronic bk.)

Standard No.: 9786613650047

Source: 10.1002/9781118166727Wiley InterSciencehttp://www3.interscience.wiley.comSubjects--Topical Terms:

880880
Three-dimensional integrated circuits.
Index Terms--Genre/Form:

554714
Electronic books.

LC Class. No.: TK7874.893 / .E7 2012

Dewey Class. No.: 621.3815

Electrical modeling and design for 3D system integration = 3D integrated circuits and packaging, signal integrity, power integrity and EMC /
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020 $a 1118166728 (electronic bk.)
020 $a 9780470623466 (hardback)
020 $a 0470623462 (hardback)
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037 $a 10.1002/9781118166727 $b Wiley InterScience $n http://www3.interscience.wiley.com
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100 1 $a Li, Er-Ping. $3 880879
245 1 0 $a Electrical modeling and design for 3D system integration $h [electronic resource] : $b 3D integrated circuits and packaging, signal integrity, power integrity and EMC / $c Er-Ping Li.
260 $a [United States] : $a Hoboken : $b IEEE Press ; $c c2012. $b Wiley,
300 $a 1 online resource.
500 $a Includes index.
504 $a Includes bibliographical references and index.
505 0 0 $t Macromodeling of Complex Interconnects in 3D Integration -- $t 2.5D Simulation Method for 3D Integrated Systems -- $t Hybrid Integral Equation Modeling Methods for 3D Integration -- $t Systematic Microwave Network Analysis for 3D Integrated Systems -- $t Modeling of Through-Silicon Vias (TSV) in 3D Integration.
650 0 $a Three-dimensional integrated circuits. $3 880880
655 7 $a Electronic books. $2 local $3 554714
710 2 $a Wiley InterScience (Online service) $3 772722
856 4 0 $3 IEEEXplore $u http://ieeexplore.ieee.org/xpl/bkabstractplus.jsp?bkn=6183551
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