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Wire bonding in microelectronics /
~
Harman, George G.
Wire bonding in microelectronics /
Record Type:
Language materials, printed : Monograph/item
Title/Author:
Wire bonding in microelectronics // George Harman.
Author:
Harman, George G.
Published:
New York ;McGraw-Hill, : c2010.,
Description:
xx, 426 p. :ill. ; : 24 cm. +; 1 CD-ROM (4 3/4 in.). +
Notes:
Previous ed.: New York: McGraw-Hill, 1997.
Subject:
Wire bonding (Electronic packaging) - Production control. -
ISBN:
9780071476232 (hbk.) :
Wire bonding in microelectronics /
Harman, George G.
Wire bonding in microelectronics /
George Harman. - 3rd ed. - New York ;McGraw-Hill,c2010. - xx, 426 p. :ill. ;24 cm. +1 CD-ROM (4 3/4 in.).
Previous ed.: New York: McGraw-Hill, 1997.
Includes bibliographical references and index.
ISBN: 9780071476232 (hbk.) :NT2827
Nat. Bib. No.: GBA8B5944bnbSubjects--Topical Terms:
895021
Wire bonding (Electronic packaging)
--Production control.
Dewey Class. No.: 621.381
Wire bonding in microelectronics /
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Wire bonding in microelectronics /
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George Harman.
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3rd ed.
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c2010.
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McGraw-Hill,
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xx, 426 p. :
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ill. ;
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24 cm. +
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1 CD-ROM (4 3/4 in.).
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Previous ed.: New York: McGraw-Hill, 1997.
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Includes bibliographical references and index.
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Wire bonding (Electronic packaging)
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Production control.
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Microelectronics.
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Ultrasonic welding.
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925719
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