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Packaging of high power semiconductor lasers

Record Type:	Language materials, printed : Monograph/item
Title/Author:	Packaging of high power semiconductor lasers/ by Xingsheng Liu ... [et al.].
other author:	Liu, Xingsheng.
Published:	New York, NY :Springer New York : : 2015.,
Description:	xv, 402 p. :ill., digital ; : 24 cm.;
Contained By:	Springer eBooks
Subject:	Semiconductor lasers. -
Online resource:	http://dx.doi.org/10.1007/978-1-4614-9263-4
ISBN:	9781461492634 (electronic bk.)

Packaging of high power semiconductor lasers
Packaging of high power semiconductor lasers[electronic resource] /by Xingsheng Liu ... [et al.]. - New York, NY :Springer New York :2015. - xv, 402 p. :ill., digital ;24 cm. - Micro- and opto-electronic materials, structures, and systems. - Micro- and opto-electronic materials, structures, and systems..

Introduction of High Power Semiconductor Lasers -- Overview of High Power Semiconductor Laser Packages -- Thermal Design and Management in High Power Semiconductor Laser Packaging -- Thermal Stress in High Power Semiconductor Lasers -- Optical Design and Beam Shaping in High Power Semiconductor Lasers -- Materials and Components in High Power Semiconductor Laser Packaging -- Packaging Process of High Power Semiconductor Lasers -- Testing and Characterization of High Power Semiconductor Lasers -- Failure Analysis and Reliability Assessment in High Power Semiconductor Laser Packaging -- Applications of High Power Semiconductor Lasers -- Development Trend and Challenges in High Power Semiconductor Laser Packaging.

This book introduces high power semiconductor laser packaging design. The characteristics and challenges of the design and various packaging, processing, and testing techniques are detailed by the authors. New technologies, in particular thermal technologies, current applications, and trends in high power semiconductor laser packaging are described at length and assessed.

ISBN: 9781461492634 (electronic bk.)

Standard No.: 10.1007/978-1-4614-9263-4doiSubjects--Topical Terms:

598316
Semiconductor lasers.

LC Class. No.: QC689.55.S45

Dewey Class. No.: 621.366

Packaging of high power semiconductor lasers
LDR:02108nam a2200325 a 4500 001 834072
003 DE-He213
005 20150511155035.0
006 m d
007 cr nn 008maaau
008 160421s2015 nyu s 0 eng d
020 $a 9781461492634 (electronic bk.)
020 $a 9781461492627 (paper)
024 7 $a 10.1007/978-1-4614-9263-4 $2 doi
035 $a 978-1-4614-9263-4
040 $a GP $c GP
041 0 $a eng
050 4 $a QC689.55.S45
072 7 $a TH $2 bicssc
072 7 $a TEC031000 $2 bisacsh
082 0 4 $a 621.366 $2 23
090 $a QC689.55.S45 $b P119 2015
245 0 0 $a Packaging of high power semiconductor lasers $h [electronic resource] / $c by Xingsheng Liu ... [et al.].
260 $a New York, NY : $b Springer New York : $b Imprint: Springer, $c 2015.
300 $a xv, 402 p. : $b ill., digital ; $c 24 cm.
490 1 $a Micro- and opto-electronic materials, structures, and systems
505 0 $a Introduction of High Power Semiconductor Lasers -- Overview of High Power Semiconductor Laser Packages -- Thermal Design and Management in High Power Semiconductor Laser Packaging -- Thermal Stress in High Power Semiconductor Lasers -- Optical Design and Beam Shaping in High Power Semiconductor Lasers -- Materials and Components in High Power Semiconductor Laser Packaging -- Packaging Process of High Power Semiconductor Lasers -- Testing and Characterization of High Power Semiconductor Lasers -- Failure Analysis and Reliability Assessment in High Power Semiconductor Laser Packaging -- Applications of High Power Semiconductor Lasers -- Development Trend and Challenges in High Power Semiconductor Laser Packaging.
520 $a This book introduces high power semiconductor laser packaging design. The characteristics and challenges of the design and various packaging, processing, and testing techniques are detailed by the authors. New technologies, in particular thermal technologies, current applications, and trends in high power semiconductor laser packaging are described at length and assessed.
650 0 $a Semiconductor lasers. $3 598316
650 0 $a Electronic packaging. $3 556061
650 1 4 $a Energy. $3 784773
650 2 4 $a Energy Systems. $3 785876
700 1 $a Liu, Xingsheng. $3 1062262
710 2 $a SpringerLink (Online service) $3 593884
773 0 $t Springer eBooks
830 0 $a Micro- and opto-electronic materials, structures, and systems. $3 1062263
856 4 0 $u http://dx.doi.org/10.1007/978-1-4614-9263-4
950 $a Engineering (Springer-11647)