國立虎尾科技大學 |

Carbon nanotube based VLSI interconnects = analysis and design /

Record Type:	Language materials, printed : Monograph/item
Title/Author:	Carbon nanotube based VLSI interconnects/ by Brajesh Kumar Kaushik, Manoj Kumar Majumder.
Reminder of title:	analysis and design /
Author:	Kaushik, Brajesh Kumar.
other author:	Majumder, Manoj Kumar.
Published:	New Delhi :Springer India : : 2015.,
Description:	xi, 86 p. :ill., digital ; : 24 cm.;
Contained By:	Springer eBooks
Subject:	Interconnects (Integrated circuit technology) -
Online resource:	http://dx.doi.org/10.1007/978-81-322-2047-3
ISBN:	9788132220473 (electronic bk.)

Carbon nanotube based VLSI interconnects = analysis and design /
Kaushik, Brajesh Kumar.

Carbon nanotube based VLSI interconnectsanalysis and design /[electronic resource] :by Brajesh Kumar Kaushik, Manoj Kumar Majumder. - New Delhi :Springer India :2015. - xi, 86 p. :ill., digital ;24 cm. - SpringerBriefs in applied sciences and technology,2191-530X. - SpringerBriefs in applied sciences and technology..

Interconnects -- Carbon Nanotube -- Properties and Applications -- Modeling of Carbon Nanotube Interconnects -- Crosstalk and Delay Analysis -- Mixed Carbon Nanotube Bundle -- References.

The brief primarily focuses on the performance analysis of CNT based interconnects in current research scenario. Different CNT structures are modeled on the basis of transmission line theory. Performance comparison for different CNT structures illustrates that CNTs are more promising than Cu or other materials used in global VLSI interconnects. The brief is organized into five chapters which mainly discuss: (1) an overview of current research scenario and basics of interconnects; (2) unique crystal structures and the basics of physical properties of CNTs, and the production, purification and applications of CNTs; (3) a brief technical review, the geometry and equivalent RLC parameters for different single and bundled CNT structures; (4) a comparative analysis of crosstalk and delay for different single and bundled CNT structures; and (5) various unique mixed CNT bundle structures and their equivalent electrical models.

ISBN: 9788132220473 (electronic bk.)

Standard No.: 10.1007/978-81-322-2047-3doiSubjects--Topical Terms:

655374
Interconnects (Integrated circuit technology)

LC Class. No.: TK7874.53

Dewey Class. No.: 621.395

Carbon nanotube based VLSI interconnects = analysis and design /
LDR:02161nam a2200325 a 4500 001 835174
003 DE-He213
005 20150715091434.0
006 m d
007 cr nn 008maaau
008 160421s2015 ii s 0 eng d
020 $a 9788132220473 (electronic bk.)
020 $a 9788132220466 (paper)
024 7 $a 10.1007/978-81-322-2047-3 $2 doi
035 $a 978-81-322-2047-3
040 $a GP $c GP
041 0 $a eng
050 4 $a TK7874.53
072 7 $a TDPB $2 bicssc
072 7 $a TEC027000 $2 bisacsh
082 0 4 $a 621.395 $2 23
090 $a TK7874.53 $b .K21 2015
100 1 $a Kaushik, Brajesh Kumar. $3 783480
245 1 0 $a Carbon nanotube based VLSI interconnects $h [electronic resource] : $b analysis and design / $c by Brajesh Kumar Kaushik, Manoj Kumar Majumder.
260 $a New Delhi : $c 2015. $b Springer India : $b Imprint: Springer,
300 $a xi, 86 p. : $b ill., digital ; $c 24 cm.
490 1 $a SpringerBriefs in applied sciences and technology, $x 2191-530X
505 0 $a Interconnects -- Carbon Nanotube -- Properties and Applications -- Modeling of Carbon Nanotube Interconnects -- Crosstalk and Delay Analysis -- Mixed Carbon Nanotube Bundle -- References.
520 $a The brief primarily focuses on the performance analysis of CNT based interconnects in current research scenario. Different CNT structures are modeled on the basis of transmission line theory. Performance comparison for different CNT structures illustrates that CNTs are more promising than Cu or other materials used in global VLSI interconnects. The brief is organized into five chapters which mainly discuss: (1) an overview of current research scenario and basics of interconnects; (2) unique crystal structures and the basics of physical properties of CNTs, and the production, purification and applications of CNTs; (3) a brief technical review, the geometry and equivalent RLC parameters for different single and bundled CNT structures; (4) a comparative analysis of crosstalk and delay for different single and bundled CNT structures; and (5) various unique mixed CNT bundle structures and their equivalent electrical models.
650 0 $a Interconnects (Integrated circuit technology) $3 655374
650 0 $a Integrated circuits $x Very large scale integration $v Design and construction. $3 643328
650 0 $a Carbon nanotubes. $3 975582
650 1 4 $a Engineering. $3 561152
650 2 4 $a Nanotechnology and Microengineering. $3 722030
650 2 4 $a Circuits and Systems. $3 670901
650 2 4 $a Optical and Electronic Materials. $3 593919
700 1 $a Majumder, Manoj Kumar. $3 1064219
710 2 $a SpringerLink (Online service) $3 593884
773 0 $t Springer eBooks
830 0 $a SpringerBriefs in applied sciences and technology. $3 885514
856 4 0 $u http://dx.doi.org/10.1007/978-81-322-2047-3
950 $a Engineering (Springer-11647)