國立虎尾科技大學 |

Investigations on microstructure and mechanical properties of the Cu/Pb-free solder joint interfaces

Record Type:	Language materials, printed : Monograph/item
Title/Author:	Investigations on microstructure and mechanical properties of the Cu/Pb-free solder joint interfaces/ by Qingke Zhang.
Author:	Zhang, Qingke.
Published:	Berlin, Heidelberg :Springer Berlin Heidelberg : : 2016.,
Description:	xv, 143 p. :ill., digital ; : 24 cm.;
Contained By:	Springer eBooks
Subject:	Lead-free electronics manufacturing processes - Research. -
Online resource:	http://dx.doi.org/10.1007/978-3-662-48823-2
ISBN:	9783662488232

Investigations on microstructure and mechanical properties of the Cu/Pb-free solder joint interfaces
Zhang, Qingke.

Investigations on microstructure and mechanical properties of the Cu/Pb-free solder joint interfaces[electronic resource] /by Qingke Zhang. - Berlin, Heidelberg :Springer Berlin Heidelberg :2016. - xv, 143 p. :ill., digital ;24 cm. - Springer theses,2190-5053. - Springer theses..

Research Progress in Pb-free Soldering -- Fracture Behavior of IMCs at Cu/Pb-free Solder Interface -- Tensile-compress Fatigue Behavior of Solder Joints -- Shear Creep-fatigue Behavior of Cu/Pb-free Solder Joints -- Thermal Fatigue Behavior of Sn-Ag/Cu Solder Joints -- Conclusions.

This thesis presents a series of mechanical test methods and comprehensively investigates the deformation and damage behavior of Cu/Pb-free solder joints under different loading conditions. The fracture behavior of Pb-free joint interfaces induced by stress, deformation of solder and substrate are shown, the shear fracture strength of the Cu6Sn5 IMC is measured experimentally for the first time, and the dynamic damage process and microstructure evolution behavior of Pb-free solder joints are revealed intuitively. The thesis puts forward the argument that the local cumulative damage is the major cause of failure in solder joints. The research results provide the experimental and theoretical basis for improving the reliability of solder joints.

ISBN: 9783662488232

Standard No.: 10.1007/978-3-662-48823-2doiSubjects--Topical Terms:

1102854
Lead-free electronics manufacturing processes
--Research.

LC Class. No.: TK7836

Dewey Class. No.: 621.381

Investigations on microstructure and mechanical properties of the Cu/Pb-free solder joint interfaces
LDR:02088nam a2200337 a 4500 001 860897
003 DE-He213
005 20160722150140.0
006 m d
007 cr nn 008maaau
008 170720s2016 gw s 0 eng d
020 $a 9783662488232 $q (electronic bk.)
020 $a 9783662488218 $q (paper)
024 7 $a 10.1007/978-3-662-48823-2 $2 doi
035 $a 978-3-662-48823-2
040 $a GP $c GP
041 0 $a eng
050 4 $a TK7836
072 7 $a TGB $2 bicssc
072 7 $a SCI041000 $2 bisacsh
072 7 $a TEC009070 $2 bisacsh
082 0 4 $a 621.381 $2 23
090 $a TK7836 $b .Z63 2016
100 1 $a Zhang, Qingke. $3 1102853
245 1 0 $a Investigations on microstructure and mechanical properties of the Cu/Pb-free solder joint interfaces $h [electronic resource] / $c by Qingke Zhang.
260 $a Berlin, Heidelberg : $c 2016. $b Springer Berlin Heidelberg : $b Imprint: Springer,
300 $a xv, 143 p. : $b ill., digital ; $c 24 cm.
490 1 $a Springer theses, $x 2190-5053
505 0 $a Research Progress in Pb-free Soldering -- Fracture Behavior of IMCs at Cu/Pb-free Solder Interface -- Tensile-compress Fatigue Behavior of Solder Joints -- Shear Creep-fatigue Behavior of Cu/Pb-free Solder Joints -- Thermal Fatigue Behavior of Sn-Ag/Cu Solder Joints -- Conclusions.
520 $a This thesis presents a series of mechanical test methods and comprehensively investigates the deformation and damage behavior of Cu/Pb-free solder joints under different loading conditions. The fracture behavior of Pb-free joint interfaces induced by stress, deformation of solder and substrate are shown, the shear fracture strength of the Cu6Sn5 IMC is measured experimentally for the first time, and the dynamic damage process and microstructure evolution behavior of Pb-free solder joints are revealed intuitively. The thesis puts forward the argument that the local cumulative damage is the major cause of failure in solder joints. The research results provide the experimental and theoretical basis for improving the reliability of solder joints.
650 0 $a Lead-free electronics manufacturing processes $x Research. $3 1102854
650 0 $a Solder and soldering $x Design and construction. $3 1102855
650 0 $a Electronics $x Materials. $3 641591
650 1 4 $a Engineering. $3 561152
650 2 4 $a Structural Mechanics. $3 670550
650 2 4 $a Surfaces and Interfaces, Thin Films. $3 671207
650 2 4 $a Mechanics. $3 527684
650 2 4 $a Characterization and Evaluation of Materials. $3 674449
710 2 $a SpringerLink (Online service) $3 593884
773 0 $t Springer eBooks
830 0 $a Springer theses. $3 831604
856 4 0 $u http://dx.doi.org/10.1007/978-3-662-48823-2
950 $a Engineering (Springer-11647)