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3D microelectronic packaging : = fro...
~
Goyal, Deepak,
3D microelectronic packaging : = from fundamentals to applications /
Record Type:
Language materials, printed : Monograph/item
Title/Author:
3D microelectronic packaging :/ Yan Li, Deepak Goyal, editors.
Reminder of title:
from fundamentals to applications /
remainder title:
Three dimensional microelectronic packaging
other author:
Li, Yan,
Published:
Cham, Switzerland :Springer, : c2017.,
Description:
ix, 463 p. :ill. (some col.) ; : 25 cm.;
Subject:
Microelectronics - Packaging. -
ISBN:
9783319445847 (cloth) :
3D microelectronic packaging : = from fundamentals to applications /
3D microelectronic packaging :
from fundamentals to applications /Three dimensional microelectronic packagingYan Li, Deepak Goyal, editors. - Cham, Switzerland :Springer,c2017. - ix, 463 p. :ill. (some col.) ;25 cm. - Springer series in advanced microelectronics,volume 571437-0387 ;. - Springer series in advanced microelectronics ;33..
Includes bibliographical references and index.
ISBN: 9783319445847 (cloth) :NT7178
LCCN: 2016954441Subjects--Topical Terms:
1127490
Microelectronics
--Packaging.
LC Class. No.: TK7874
Dewey Class. No.: 621.381
3D microelectronic packaging : = from fundamentals to applications /
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888202
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