3D microelectronic packaging : = fro...
Goyal, Deepak,

 

  • 3D microelectronic packaging : = from fundamentals to applications /
  • Record Type: Language materials, printed : Monograph/item
    Title/Author: 3D microelectronic packaging :/ Yan Li, Deepak Goyal, editors.
    Reminder of title: from fundamentals to applications /
    remainder title: Three dimensional microelectronic packaging
    other author: Li, Yan,
    Published: Cham, Switzerland :Springer, : c2017.,
    Description: ix, 463 p. :ill. (some col.) ; : 25 cm.;
    Subject: Microelectronics - Packaging. -
    ISBN: 9783319445847 (cloth) :
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  • 1 records • Pages 1 •
 
E044079 圖書館3F 書庫 一般圖書(BOOK) 一般圖書 621.381 T531 2017 一般使用(Normal) On shelf 0
  • 1 records • Pages 1 •
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