國立虎尾科技大學 |

Laser microjoining of dissimilar materials.

Record Type:	Language materials, manuscript : Monograph/item
Title/Author:	Laser microjoining of dissimilar materials./
Author:	Mahmood, Tonfiz Uddin.
Description:	1 online resource (168 pages)
Notes:	Source: Dissertation Abstracts International, Volume: 69-08, Section: B, page: 4985.
Contained By:	Dissertation Abstracts International69-08B.
Subject:	Mechanical engineering. -
Online resource:	click for full text (PQDT)
ISBN:	9780549793250

Laser microjoining of dissimilar materials.
Mahmood, Tonfiz Uddin.

Laser microjoining of dissimilar materials. - 1 online resource (168 pages)

Source: Dissertation Abstracts International, Volume: 69-08, Section: B, page: 4985.

Thesis (Ph.D.)--Wayne State University, 2008.

Includes bibliographical references

Transmission laser bonding (TLB) is used to join dissimilar materials in implant devices because of its many advantageous features over the conventional joining techniques, in addition to its essential biocompatible property. Although some experimental works are reported in the literature, TLB is not studied well. We have investigated the mechanism of TLB joining process of dissimilar materials by finite element analysis. The effect of process parameters such beam scanning speed, the power and the diameter of the laser beam studied to optimize transmission bond for both diode laser and fiber laser. Finite element model simulation provides quick and reliable way to study the effect of process parameters to ensure optimized bonding conditions. The quality of the bond is characterized by the strength of bond which is measured by microtester for lap joint using rectangular samples. Bond performance in normal environment and bio environment were determined. An alternative technique for bond evaluation using pressure testing has been developed using miniaturized samples.

Electronic reproduction.
Ann Arbor, Mich. :
ProQuest,
2018

Mode of access: World Wide Web

ISBN: 9780549793250Subjects--Topical Terms:

557493
Mechanical engineering.
Index Terms--Genre/Form:

554714
Electronic books.

Laser microjoining of dissimilar materials.
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100 1 $a Mahmood, Tonfiz Uddin. $3 1189528
245 1 0 $a Laser microjoining of dissimilar materials.
264 0 $c 2008
300 $a 1 online resource (168 pages)
336 $a text $b txt $2 rdacontent
337 $a computer $b c $2 rdamedia
338 $a online resource $b cr $2 rdacarrier
500 $a Source: Dissertation Abstracts International, Volume: 69-08, Section: B, page: 4985.
500 $a Adviser: Golam M. Newaz.
502 $a Thesis (Ph.D.)--Wayne State University, 2008.
504 $a Includes bibliographical references
520 $a Transmission laser bonding (TLB) is used to join dissimilar materials in implant devices because of its many advantageous features over the conventional joining techniques, in addition to its essential biocompatible property. Although some experimental works are reported in the literature, TLB is not studied well. We have investigated the mechanism of TLB joining process of dissimilar materials by finite element analysis. The effect of process parameters such beam scanning speed, the power and the diameter of the laser beam studied to optimize transmission bond for both diode laser and fiber laser. Finite element model simulation provides quick and reliable way to study the effect of process parameters to ensure optimized bonding conditions. The quality of the bond is characterized by the strength of bond which is measured by microtester for lap joint using rectangular samples. Bond performance in normal environment and bio environment were determined. An alternative technique for bond evaluation using pressure testing has been developed using miniaturized samples.
520 $a The experimental data and numerical analysis shows no bonding is possible at 1W power for fiber laser. At higher power level the bonding is possible. But this depends on scanning speed of the laser beam. If the scanning velocity is too slow, the joining substrates get heated significantly such that molten substrate can vaporize to some extent resulting in a weak or no bonding condition. Again too fast scanning of the laser beam does not provide enough heat energy to the joining substrate to melt and form a bond to the adjacent layer.
533 $a Electronic reproduction. $b Ann Arbor, Mich. : $c ProQuest, $d 2018
538 $a Mode of access: World Wide Web
650 4 $a Mechanical engineering. $3 557493
650 4 $a Biomedical engineering. $3 588770
655 7 $a Electronic books. $2 local $3 554714
690 $a 0548
690 $a 0541
710 2 $a ProQuest Information and Learning Co. $3 1178819
710 2 $a Wayne State University. $b Mechanical Engineering. $3 845648
773 0 $t Dissertation Abstracts International $g 69-08B.
856 4 0 $u http://pqdd.sinica.edu.tw/twdaoapp/servlet/advanced?query=3325312 $z click for full text (PQDT)