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3D Flash Memories

Record Type:	Language materials, printed : Monograph/item
Title/Author:	3D Flash Memories/ edited by Rino Micheloni.
other author:	Micheloni, Rino.
Description:	XXII, 380 p. 396 illus., 304 illus. in color.online resource. :
Contained By:	Springer Nature eBook
Subject:	Computer memory systems. -
Online resource:	https://doi.org/10.1007/978-94-017-7512-0
ISBN:	9789401775120

3D Flash Memories
3D Flash Memories[electronic resource] /edited by Rino Micheloni. - 1st ed. 2016. - XXII, 380 p. 396 illus., 304 illus. in color.online resource.

Dedication Page -- Foreword -- Preface -- Introduction -- About the Editor -- Acknowledgements -- 1 The Business of NAND -- 2 Reliability of 3D NAND Flash memories -- 3 3D Stacked NAND Flash memories -- 4 3D Charge Trap NAND Flash memories -- 5 3D Floating Gate NAND Flash memories -- 6 Advanced Architectures for 3D NAND Flash memories with vertical channel -- 7 3D VG-Type NAND Flash memories -- 8 RRAM Cross-point arrays -- 9 3D Multi-Chip Integration and Packaging Technology -- 10 BCH and LDPC Error Correction Codes for NAND Flash memories -- 11 Advanced algebraic and graph-based ECC schemes for modern NVMs -- 12 System-Level Considerations on Design of 3D NAND Flash memories -- Index.

This book walks the reader through the next step in the evolution of NAND flash memory technology, namely the development of 3D flash memories, in which multiple layers of memory cells are grown within the same piece of silicon. It describes their working principles, device architectures, fabrication techniques and practical implementations, and highlights why 3D flash is a brand new technology. After reviewing market trends for both NAND and solid state drives (SSDs), the book digs into the details of the flash memory cell itself, covering both floating gate and emerging charge trap technologies. There is a plethora of different materials and vertical integration schemes out there. New memory cells, new materials, new architectures (3D Stacked, BiCS and P-BiCS, 3D FG, 3D VG, 3D advanced architectures); basically, each NAND manufacturer has its own solution. Chapter 3 to chapter 7 offer a broad overview of how 3D can materialize. The 3D wave is impacting emerging memories as well and chapter 8 covers 3D RRAM (resistive RAM) crosspoint arrays. Visualizing 3D structures can be a challenge for the human brain: this is way all these chapters contain a lot of bird’s-eye views and cross sections along the 3 axes. The second part of the book is devoted to other important aspects, such as advanced packaging technology (i.e. TSV in chapter 9) and error correction codes, which have been leveraged to improve flash reliability for decades. Chapter 10 describes the evolution from legacy BCH to the most recent LDPC codes, while chapter 11 deals with some of the most recent advancements in the ECC field. Last but not least, chapter 12 looks at 3D flash memories from a system perspective. Is 14nm the last step for planar cells? Can 100 layers be integrated within the same piece of silicon? Is 4 bit/cell possible with 3D? Will 3D be reliable enough for enterprise and datacenter applications? These are some of the questions that this book helps answering by providing insights into 3D flash memory design, process technology and applications.

ISBN: 9789401775120

Standard No.: 10.1007/978-94-017-7512-0doiSubjects--Topical Terms:

1260919
Computer memory systems.

LC Class. No.: TK7895.M4

Dewey Class. No.: 004.53

3D Flash Memories
LDR:04089nam a22004095i 4500 001 979149
003 DE-He213
005 20200701163300.0
007 cr nn 008mamaa
008 201211s2016 ne | s |||| 0|eng d
020 $a 9789401775120 $9 978-94-017-7512-0
024 7 $a 10.1007/978-94-017-7512-0 $2 doi
035 $a 978-94-017-7512-0
050 4 $a TK7895.M4
072 7 $a UKS $2 bicssc
072 7 $a COM067000 $2 bisacsh
072 7 $a UKS $2 thema
072 7 $a UYF $2 thema
082 0 4 $a 004.53 $2 23
245 1 0 $a 3D Flash Memories $h [electronic resource] / $c edited by Rino Micheloni.
250 $a 1st ed. 2016.
264 1 $a Dordrecht : $b Springer Netherlands : $b Imprint: Springer, $c 2016.
300 $a XXII, 380 p. 396 illus., 304 illus. in color. $b online resource.
336 $a text $b txt $2 rdacontent
337 $a computer $b c $2 rdamedia
338 $a online resource $b cr $2 rdacarrier
347 $a text file $b PDF $2 rda
505 0 $a Dedication Page -- Foreword -- Preface -- Introduction -- About the Editor -- Acknowledgements -- 1 The Business of NAND -- 2 Reliability of 3D NAND Flash memories -- 3 3D Stacked NAND Flash memories -- 4 3D Charge Trap NAND Flash memories -- 5 3D Floating Gate NAND Flash memories -- 6 Advanced Architectures for 3D NAND Flash memories with vertical channel -- 7 3D VG-Type NAND Flash memories -- 8 RRAM Cross-point arrays -- 9 3D Multi-Chip Integration and Packaging Technology -- 10 BCH and LDPC Error Correction Codes for NAND Flash memories -- 11 Advanced algebraic and graph-based ECC schemes for modern NVMs -- 12 System-Level Considerations on Design of 3D NAND Flash memories -- Index.
520 $a This book walks the reader through the next step in the evolution of NAND flash memory technology, namely the development of 3D flash memories, in which multiple layers of memory cells are grown within the same piece of silicon. It describes their working principles, device architectures, fabrication techniques and practical implementations, and highlights why 3D flash is a brand new technology. After reviewing market trends for both NAND and solid state drives (SSDs), the book digs into the details of the flash memory cell itself, covering both floating gate and emerging charge trap technologies. There is a plethora of different materials and vertical integration schemes out there. New memory cells, new materials, new architectures (3D Stacked, BiCS and P-BiCS, 3D FG, 3D VG, 3D advanced architectures); basically, each NAND manufacturer has its own solution. Chapter 3 to chapter 7 offer a broad overview of how 3D can materialize. The 3D wave is impacting emerging memories as well and chapter 8 covers 3D RRAM (resistive RAM) crosspoint arrays. Visualizing 3D structures can be a challenge for the human brain: this is way all these chapters contain a lot of bird’s-eye views and cross sections along the 3 axes. The second part of the book is devoted to other important aspects, such as advanced packaging technology (i.e. TSV in chapter 9) and error correction codes, which have been leveraged to improve flash reliability for decades. Chapter 10 describes the evolution from legacy BCH to the most recent LDPC codes, while chapter 11 deals with some of the most recent advancements in the ECC field. Last but not least, chapter 12 looks at 3D flash memories from a system perspective. Is 14nm the last step for planar cells? Can 100 layers be integrated within the same piece of silicon? Is 4 bit/cell possible with 3D? Will 3D be reliable enough for enterprise and datacenter applications? These are some of the questions that this book helps answering by providing insights into 3D flash memory design, process technology and applications.
650 0 $a Computer memory systems. $3 1260919
650 0 $a Electronic circuits. $3 563332
650 1 4 $a Memory Structures. $3 677022
650 2 4 $a Electronic Circuits and Devices. $3 782968
650 2 4 $a Circuits and Systems. $3 670901
700 1 $a Micheloni, Rino. $4 edt $4 http://id.loc.gov/vocabulary/relators/edt $3 671248
710 2 $a SpringerLink (Online service) $3 593884
773 0 $t Springer Nature eBook
776 0 8 $i Printed edition: $z 9789401775106
776 0 8 $i Printed edition: $z 9789401775113
776 0 8 $i Printed edition: $z 9789402413656
856 4 0 $u https://doi.org/10.1007/978-94-017-7512-0
912 $a ZDB-2-SCS
912 $a ZDB-2-SXCS
950 $a Computer Science (SpringerNature-11645)
950 $a Computer Science (R0) (SpringerNature-43710)