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Crosstalk in Modern On-Chip Interconnects = A FDTD Approach /

Record Type:	Language materials, printed : Monograph/item
Title/Author:	Crosstalk in Modern On-Chip Interconnects/ by B.K. Kaushik, V. Ramesh Kumar, Amalendu Patnaik.
Reminder of title:	A FDTD Approach /
Author:	Kaushik, B.K.
other author:	Kumar, V. Ramesh.
Description:	XV, 116 p. 71 illus.online resource. :
Contained By:	Springer Nature eBook
Subject:	Nanotechnology. -
Online resource:	https://doi.org/10.1007/978-981-10-0800-9
ISBN:	9789811008009

Crosstalk in Modern On-Chip Interconnects = A FDTD Approach /
Kaushik, B.K.

Crosstalk in Modern On-Chip InterconnectsA FDTD Approach /[electronic resource] :by B.K. Kaushik, V. Ramesh Kumar, Amalendu Patnaik. - 1st ed. 2016. - XV, 116 p. 71 illus.online resource. - SpringerBriefs in Applied Sciences and Technology,2191-530X. - SpringerBriefs in Applied Sciences and Technology,.

Introduction to On-chip Interconnects and Modeling -- Interconnect Modeling, CNT and GNR Structure, Properties and Characteristics -- FDTD Model for Crosstalk Analysis of CMOS Gate-Driven Coupled Copper Interconnects -- FDTD Model for Crosstalk Analysis of Multiwall Carbon Nanotube (MWCNT) Interconnects -- Crosstalk Modeling with Width Dependent MFP in MLGNR Interconnects Using FDTD Technique -- An Efficient US-FDTD Model for Crosstalk Analysis of On-chip Interconnects.

The book provides accurate FDTD models for on-chip interconnects, covering most recent advancements in materials and design. Furthermore, depending on the geometry and physical configurations, different electrical equivalent models for CNT and GNR based interconnects are presented. Based on the electrical equivalent models the performance comparison among the Cu, CNT and GNR-based interconnects are also discussed in the book. The proposed models are validated with the HSPICE simulations. The book introduces the current research scenario in the modeling of on-chip interconnects. It presents the structure, properties, and characteristics of graphene based on-chip interconnects and the FDTD modeling of Cu based on-chip interconnects. The model considers the non-linear effects of CMOS driver as well as the transmission line effects of interconnect line that includes coupling capacitance and mutual inductance effects. In a more realistic manner, the proposed model includes the effect of width-dependent MFP of the MLGNR while taking into account the edge roughness.

ISBN: 9789811008009

Standard No.: 10.1007/978-981-10-0800-9doiSubjects--Topical Terms:

557660
Nanotechnology.

LC Class. No.: T174.7

Dewey Class. No.: 620.5

Crosstalk in Modern On-Chip Interconnects = A FDTD Approach /
LDR:02915nam a22003975i 4500 001 982444
003 DE-He213
005 20200630003100.0
007 cr nn 008mamaa
008 201211s2016 si | s |||| 0|eng d
020 $a 9789811008009 $9 978-981-10-0800-9
024 7 $a 10.1007/978-981-10-0800-9 $2 doi
035 $a 978-981-10-0800-9
050 4 $a T174.7
072 7 $a TDPB $2 bicssc
072 7 $a TEC027000 $2 bisacsh
072 7 $a TDP $2 thema
082 0 4 $a 620.5 $2 23
100 1 $a Kaushik, B.K. $e author. $4 aut $4 http://id.loc.gov/vocabulary/relators/aut $3 1274545
245 1 0 $a Crosstalk in Modern On-Chip Interconnects $h [electronic resource] : $b A FDTD Approach / $c by B.K. Kaushik, V. Ramesh Kumar, Amalendu Patnaik.
250 $a 1st ed. 2016.
264 1 $a Singapore : $b Springer Singapore : $b Imprint: Springer, $c 2016.
300 $a XV, 116 p. 71 illus. $b online resource.
336 $a text $b txt $2 rdacontent
337 $a computer $b c $2 rdamedia
338 $a online resource $b cr $2 rdacarrier
347 $a text file $b PDF $2 rda
490 1 $a SpringerBriefs in Applied Sciences and Technology, $x 2191-530X
505 0 $a Introduction to On-chip Interconnects and Modeling -- Interconnect Modeling, CNT and GNR Structure, Properties and Characteristics -- FDTD Model for Crosstalk Analysis of CMOS Gate-Driven Coupled Copper Interconnects -- FDTD Model for Crosstalk Analysis of Multiwall Carbon Nanotube (MWCNT) Interconnects -- Crosstalk Modeling with Width Dependent MFP in MLGNR Interconnects Using FDTD Technique -- An Efficient US-FDTD Model for Crosstalk Analysis of On-chip Interconnects.
520 $a The book provides accurate FDTD models for on-chip interconnects, covering most recent advancements in materials and design. Furthermore, depending on the geometry and physical configurations, different electrical equivalent models for CNT and GNR based interconnects are presented. Based on the electrical equivalent models the performance comparison among the Cu, CNT and GNR-based interconnects are also discussed in the book. The proposed models are validated with the HSPICE simulations. The book introduces the current research scenario in the modeling of on-chip interconnects. It presents the structure, properties, and characteristics of graphene based on-chip interconnects and the FDTD modeling of Cu based on-chip interconnects. The model considers the non-linear effects of CMOS driver as well as the transmission line effects of interconnect line that includes coupling capacitance and mutual inductance effects. In a more realistic manner, the proposed model includes the effect of width-dependent MFP of the MLGNR while taking into account the edge roughness.
650 0 $a Nanotechnology. $3 557660
650 0 $a Electronics. $3 596389
650 0 $a Microelectronics. $3 554956
650 0 $a Electronic circuits. $3 563332
650 1 4 $a Nanotechnology and Microengineering. $3 722030
650 2 4 $a Electronics and Microelectronics, Instrumentation. $3 670219
650 2 4 $a Circuits and Systems. $3 670901
700 1 $a Kumar, V. Ramesh. $4 aut $4 http://id.loc.gov/vocabulary/relators/aut $3 1107922
700 1 $a Patnaik, Amalendu. $4 aut $4 http://id.loc.gov/vocabulary/relators/aut $3 1107923
710 2 $a SpringerLink (Online service) $3 593884
773 0 $t Springer Nature eBook
776 0 8 $i Printed edition: $z 9789811007996
776 0 8 $i Printed edition: $z 9789811008016
830 0 $a SpringerBriefs in Applied Sciences and Technology, $x 2191-530X $3 1253575
856 4 0 $u https://doi.org/10.1007/978-981-10-0800-9
912 $a ZDB-2-ENG
912 $a ZDB-2-SXE
950 $a Engineering (SpringerNature-11647)
950 $a Engineering (R0) (SpringerNature-43712)