國立虎尾科技大學 |

Advanced Packaging and Manufacturing Technology Based on Adhesion Engineering = Wafer-Level Transfer Packaging and Fabrication Techniques Using Interface Energy Control Method /

Record Type:	Language materials, printed : Monograph/item
Title/Author:	Advanced Packaging and Manufacturing Technology Based on Adhesion Engineering/ by Seonho Seok.
Reminder of title:	Wafer-Level Transfer Packaging and Fabrication Techniques Using Interface Energy Control Method /
Author:	Seok, Seonho.
Description:	VIII, 115 p. 106 illus.online resource. :
Contained By:	Springer Nature eBook
Subject:	Manufactures. -
Online resource:	https://doi.org/10.1007/978-3-319-77872-3
ISBN:	9783319778723

Advanced Packaging and Manufacturing Technology Based on Adhesion Engineering = Wafer-Level Transfer Packaging and Fabrication Techniques Using Interface Energy Control Method /
Seok, Seonho.

Advanced Packaging and Manufacturing Technology Based on Adhesion EngineeringWafer-Level Transfer Packaging and Fabrication Techniques Using Interface Energy Control Method /[electronic resource] :by Seonho Seok. - 1st ed. 2018. - VIII, 115 p. 106 illus.online resource. - Springer Series in Advanced Manufacturing,1860-5168. - Springer Series in Advanced Manufacturing,.

Overview of MEMS packaging technologies -- Adhesion control techniques for debonding -- FEM modeling of debonding -- Polymer cap transfer packaging technologies -- Thin film cap transfer packaging technology -- Other related manufacturing technologies. .

This book introduces microelectromechanical systems (MEMS) packaging utilizing polymers or thin films – a new and unique packaging technology. It first investigates the relationship between applied load and opening displacement as a function of benzocyclobutene (BCB) cap size to find the debonding behavior, and then presents BCB cap deformation and stress development at different opening displacements as a function of BCB thickness, which is a criterion for BCB cap transfer failure. Transfer packaging techniques are attracting increasing interest because they deliver packaging caps, from carrier wafers to device wafers, and minimize the fabrication issues frequently encountered in thin-film or polymer cap encapsulation. The book describes very-low-loss polymer cap or thin-film-transfer techniques based on anti-adhesion coating methods for radio frequency (RF) (-MEMS) device packaging. Since the polymer caps are susceptible to deformation due to their relatively low mechanical stiffness during debonding of the carrier wafer, the book develops an appropriate finite element model (FEM) to simulate the debonding process occurring in the interface between Si carrier wafer and BCB cap. Lastly, it includes the load–displacement curve of different materials and presents a flexible polymer filter and a tunable filter as examples of the applications of the proposed technology.

ISBN: 9783319778723

Standard No.: 10.1007/978-3-319-77872-3doiSubjects--Topical Terms:

680602
Manufactures.

LC Class. No.: TS1-2301

Dewey Class. No.: 670

Advanced Packaging and Manufacturing Technology Based on Adhesion Engineering = Wafer-Level Transfer Packaging and Fabrication Techniques Using Interface Energy Control Method /
LDR:03145nam a22004095i 4500 001 992863
003 DE-He213
005 20200703092235.0
007 cr nn 008mamaa
008 201225s2018 gw | s |||| 0|eng d
020 $a 9783319778723 $9 978-3-319-77872-3
024 7 $a 10.1007/978-3-319-77872-3 $2 doi
035 $a 978-3-319-77872-3
050 4 $a TS1-2301
072 7 $a TGP $2 bicssc
072 7 $a TEC020000 $2 bisacsh
072 7 $a TGP $2 thema
082 0 4 $a 670 $2 23
100 1 $a Seok, Seonho. $4 aut $4 http://id.loc.gov/vocabulary/relators/aut $3 1203787
245 1 0 $a Advanced Packaging and Manufacturing Technology Based on Adhesion Engineering $h [electronic resource] : $b Wafer-Level Transfer Packaging and Fabrication Techniques Using Interface Energy Control Method / $c by Seonho Seok.
250 $a 1st ed. 2018.
264 1 $a Cham : $b Springer International Publishing : $b Imprint: Springer, $c 2018.
300 $a VIII, 115 p. 106 illus. $b online resource.
336 $a text $b txt $2 rdacontent
337 $a computer $b c $2 rdamedia
338 $a online resource $b cr $2 rdacarrier
347 $a text file $b PDF $2 rda
490 1 $a Springer Series in Advanced Manufacturing, $x 1860-5168
505 0 $a Overview of MEMS packaging technologies -- Adhesion control techniques for debonding -- FEM modeling of debonding -- Polymer cap transfer packaging technologies -- Thin film cap transfer packaging technology -- Other related manufacturing technologies. .
520 $a This book introduces microelectromechanical systems (MEMS) packaging utilizing polymers or thin films – a new and unique packaging technology. It first investigates the relationship between applied load and opening displacement as a function of benzocyclobutene (BCB) cap size to find the debonding behavior, and then presents BCB cap deformation and stress development at different opening displacements as a function of BCB thickness, which is a criterion for BCB cap transfer failure. Transfer packaging techniques are attracting increasing interest because they deliver packaging caps, from carrier wafers to device wafers, and minimize the fabrication issues frequently encountered in thin-film or polymer cap encapsulation. The book describes very-low-loss polymer cap or thin-film-transfer techniques based on anti-adhesion coating methods for radio frequency (RF) (-MEMS) device packaging. Since the polymer caps are susceptible to deformation due to their relatively low mechanical stiffness during debonding of the carrier wafer, the book develops an appropriate finite element model (FEM) to simulate the debonding process occurring in the interface between Si carrier wafer and BCB cap. Lastly, it includes the load–displacement curve of different materials and presents a flexible polymer filter and a tunable filter as examples of the applications of the proposed technology.
650 0 $a Manufactures. $3 680602
650 0 $a Nanotechnology. $3 557660
650 0 $a Materials science. $3 557839
650 0 $a Tribology. $3 592076
650 0 $a Corrosion and anti-corrosives. $3 583984
650 0 $a Coatings. $3 561718
650 1 4 $a Manufacturing, Machines, Tools, Processes. $3 1226012
650 2 4 $a Nanotechnology and Microengineering. $3 722030
650 2 4 $a Characterization and Evaluation of Materials. $3 674449
650 2 4 $a Tribology, Corrosion and Coatings. $3 673589
710 2 $a SpringerLink (Online service) $3 593884
773 0 $t Springer Nature eBook
776 0 8 $i Printed edition: $z 9783319778716
776 0 8 $i Printed edition: $z 9783319778730
776 0 8 $i Printed edition: $z 9783030085612
830 0 $a Springer Series in Advanced Manufacturing, $x 1860-5168 $3 1255576
856 4 0 $u https://doi.org/10.1007/978-3-319-77872-3
912 $a ZDB-2-ENG
912 $a ZDB-2-SXE
950 $a Engineering (SpringerNature-11647)
950 $a Engineering (R0) (SpringerNature-43712)