反應曲面法.
Overview
| Works: | 14 works in 14 publications in 14 languages | |
|---|---|---|
Titles
銅箔基板鑽孔最佳化參數設計 = = Design of the Optimization Parameters for Drilling of Copper Clad Laminate /
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利用溶液製程與轉貼技術探討電洞注入層和發光層最佳化結構之有機發光二極體 = = Structure Optimization of Hole Injection and Emitting Layer Using Solution-Based Processing and Stamping for Organic Light Emitting Diodes /
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應用實驗設計法於透氣防水膜製程參數最佳化之研究 = = A Study on Optimization of Process Parameter for Breathable waterproof Membrane with Experimental Design Method /
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PET寶特瓶外觀設計對頂壓應力與位移之研究 = = A Study of Stress and Displacement of Top Load for PET Bottle Design /
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應用實驗設計法於瓶胚射出成型製程參數最佳化之研究 = = The Study of Process Parameters Optimization in the Injection Molding of Blow Technology based on the Experimental Design method /
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汽車兒童安全座椅ISOFIX裝置的開發研究 = = Development of Child Car Seat ISOFIX Device /
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考慮操作員具有不同技術水準下之型IV生產線平衡問題研究 = = A Study of Type-IV Assembly Line Balancing Problem Considering the Operators with Different Skill Levels /
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考慮操作員熟練度下多人工作站生產線平衡問題 = = Assembly Line Balancing Problems with Multi-manned Workstations Considering Skill Proficiency of Operators /
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應用反應曲面法於不同輔助銑削NiTi形狀記憶合金較佳製程參數之建構 = = Better Process Parameter Constructions by Response Surface Methodology for NiTi Shape Memory Alloy under Different Assisted Milling Environments /
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具有不同拆卸作業關聯度下之多人工作站拆卸線平衡問題 = = The Disassembly Line Balancing Problem with Multi-manned Workstations Considering Task Correlation /
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應用啟發式演算法於具時窗限制之多趟次車輛途程問題 = = Application of Heuristic Algorithms to Multi-Trip Vehicle Routing Problems with Time Windows /
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電子封裝界面結合強度量測與脫層損傷分析 = = Electronic Packaging Interfacial Strength Measurement and Delamination Investigation /
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先進扇出型封裝之銅柱凸塊可靠度分析 = = Reliability Analysis of Copper Pillar Bumps for Advanced Fan-Out Packaging /
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