語系:
繁體中文
English
說明(常見問題)
登入
跳至 :
概要
書目資訊
主題
Flip chip technology.
概要
作品:
2 作品在 2 項出版品 2 種語言
書目資訊
Advanced flip chip packaging
by:
(書目-語言資料,印刷品)
Flip-flop design in nanometer CMOS = from high speed to low energy /
by:
(書目-語言資料,印刷品)
主題
Nanotechnology and Microengineering.
Electronics and Microelectronics, Instrumentation.
Integrated circuits
Electronic Circuits and Devices.
Circuits and Systems.
Optical and Electronic Materials.
Engineering.
Metal oxide semiconductors, Complementary
Flip chip technology.
Electronic packaging.
Processor Architectures.
處理中
...
變更密碼[密碼必須為2種組合(英文和數字)及長度為10碼以上]
登入