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Advanced flip chip packaging
~
Wong, C.P.
Advanced flip chip packaging
Record Type:
Language materials, printed : Monograph/item
Title/Author:
Advanced flip chip packaging/ edited by Ho-Ming Tong, Yi-Shao Lai, C.P. Wong.
other author:
Tong, Ho-Ming.
Published:
Boston, MA :Springer US : : 2013.,
Description:
vii, 560 p. :ill., digital ; : 24 cm.;
Contained By:
Springer eBooks
Subject:
Flip chip technology. -
Online resource:
http://dx.doi.org/10.1007/978-1-4419-5768-9
ISBN:
9781441957689 (electronic bk.)
Advanced flip chip packaging
Advanced flip chip packaging
[electronic resource] /edited by Ho-Ming Tong, Yi-Shao Lai, C.P. Wong. - Boston, MA :Springer US :2013. - vii, 560 p. :ill., digital ;24 cm.
ISBN: 9781441957689 (electronic bk.)Subjects--Topical Terms:
1063278
Flip chip technology.
LC Class. No.: TK7870.15 / .A38 2013
Dewey Class. No.: 621.381046
Advanced flip chip packaging
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edited by Ho-Ming Tong, Yi-Shao Lai, C.P. Wong.
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2013.
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Imprint: Springer,
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vii, 560 p. :
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ill., digital ;
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24 cm.
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Flip chip technology.
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Tong, Ho-Ming.
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Lai, Yi-Shao.
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Engineering (Springer-11647)
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