Advanced flip chip packaging
Wong, C.P.

 

  • Advanced flip chip packaging
  • Record Type: Language materials, printed : Monograph/item
    Title/Author: Advanced flip chip packaging/ edited by Ho-Ming Tong, Yi-Shao Lai, C.P. Wong.
    other author: Tong, Ho-Ming.
    Published: Boston, MA :Springer US : : 2013.,
    Description: vii, 560 p. :ill., digital ; : 24 cm.;
    Contained By: Springer eBooks
    Subject: Flip chip technology. -
    Online resource: http://dx.doi.org/10.1007/978-1-4419-5768-9
    ISBN: 9781441957689 (electronic bk.)
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