Response Surface Methodology.

考慮操作員具有不同技術水準下之型IV生產線平衡問題研究 = = A Study of Type-IV Assembly Line Balancing Problem Considering the Operators with Different Skill Levels / by: (書目-語言資料,印刷品)

電子封裝界面結合強度量測與脫層損傷分析 = = Electronic Packaging Interfacial Strength Measurement and Delamination Investigation / by: (書目-語言資料,印刷品)

先進扇出型封裝之銅柱凸塊可靠度分析 = = Reliability Analysis of Copper Pillar Bumps for Advanced Fan-Out Packaging / by: (書目-語言資料,印刷品)

啟發式演算法.

Crack Propagation.

Strain Energy Release Rate.

Finite Element Analysis.

應變能量釋放率.

裂紋擴展.

操作員技術水準.

生產線平衡.

Operator Skill Level.

雙懸臂樑.

Heuristic Algorithms.

Thermal Cycling Test.

Delamination.

Response Surface Methodology.

Line Balancing.

反應曲面法.

Double Cantilever Beam.

翹曲.

Cu Pillar Bump.

Fan-Out Package.

溫度循環測試.

銅柱凸塊.

脫層.

扇出型封裝.

有限元素分析.

Warpage.