leakage rate.
Overview
| Works: | 1 works in 1 publications in 1 languages | |
|---|---|---|
Titles
真空積體電路封裝中對密合式封裝之預成型銲料的溫度曲線之優化 = = Optimizing Temperature Curves of Gold-Tin Preform in the Cap Encapsulation of the Vacuum IC Package /
by:
(Language materials, printed)
Subjects