脫層.

先進扇出型封裝之再分布層界面強度量測與濕-熱耦合脫層損傷分析 = = Advanced Fan-Out Packaging Interface Strength Measurement and Hygro-thermal Coupling Delamination Investigation / by: (Language materials, printed)

電子封裝界面強度量測與濕-熱耦合脫層損傷分析 = = Electronic Packaging Interface Strength Measurement and Hygro-thermal Coupling Delamination Investigation / by: (Language materials, printed)

電子封裝界面結合強度量測與脫層損傷分析 = = Electronic Packaging Interfacial Strength Measurement and Delamination Investigation / by: (Language materials, printed)

量產發光二極體封裝製程技術之改善 = = Improvement of the packaging process and technique for the LED mass production / by: (Language materials, printed)

Crack Propagation.

濕熱耦合.

Strain Energy Release Rate.

應變能量釋放率.

裂紋擴展.

CSP process.

wire bonding.

雙懸臂樑.

Delamination.

翹曲.

Response Surface Methodology.

脫層.

扇出型封裝.

Interface Strength.

Hygro-thermal Coupling.

peeling.

濕-熱耦合.

Warpage.

Fan-Out.

界面強度.

CSP製程.

反應曲面法.

Double Cantilever Beam.

銲線.

應變能釋放率.

虛擬裂紋閉合技術.

Virtual crack closure technique method.