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Interconnects (Integrated circuit technology) - Design and construction.

Overview

Works:	3 works in 1 publications in 1 languages

Titles

Three-dimensional molded interconnect devices (3D-MID) = materials, Manufacturing, assembly, and applications forinjection molded circuit carriers / by: (Language materials, printed)

Subjects

Injection molding of plastics.

Interconnects (Integrated circuit technology)

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