Silicon - Electric properties.
Overview
Works: | 12 works in 7 publications in 7 languages |
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Titles
TSV 3D RF integration : = high resistivity Si interposer technology /
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(Language materials, printed)
Smart electronic systems = heterogeneous integration of silicon and printed electronics /
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(Language materials, printed)
Low temperature polycrystalline silicon integrated analogue and digital display drivers /
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(Language materials, printed)
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