Wire bonding (Electronic packaging)

Hot Cracking Phenomena in Welds by: (Language materials, printed)

Force Sensors for Microelectronic Packaging Applications by: (Language materials, printed)

Copper wire bonding by: (Language materials, printed)

Electronics and Microelectronics, Instrumentation.

Copper wire.

Physics and Applied Physics in Engineering.

Optical and Electronic Materials.

Microelectronic packaging.

Engineering.

Quality Control, Reliability, Safety and Risk.

Wire bonding (Electronic packaging)

Mechatronics.

Operating Procedures, Materials Treatment.

Chemistry.

Nanotechnology.

Metallic Materials.

Continuum Mechanics and Mechanics of Materials.