Wire bonding (Electronic packaging)

Hot Cracking Phenomena in Welds by: (書目-語言資料,印刷品)

Force Sensors for Microelectronic Packaging Applications by: (書目-語言資料,印刷品)

Copper wire bonding by: (書目-語言資料,印刷品)

Electronics and Microelectronics, Instrumentation.

Copper wire.

Physics and Applied Physics in Engineering.

Optical and Electronic Materials.

Microelectronic packaging.

Engineering.

Quality Control, Reliability, Safety and Risk.

Wire bonding (Electronic packaging)

Mechatronics.

Operating Procedures, Materials Treatment.

Chemistry.

Nanotechnology.

Metallic Materials.

Continuum Mechanics and Mechanics of Materials.