flip-chip package
Overview
| Works: | 1 works in 1 publications in 1 languages | |
|---|---|---|
Titles
以鋅置換法製備鋁基金錫共晶堆疊層及應用於覆晶封裝之探討 = = AuSn Eutectic Stack Layer on Al substrate Used Zincating and Discussion of Flip-Chip package /
by:
(Language materials, printed)