package

電熱分離之LED投射光源模組開發 = = Development of the LED Injecting Modules Based on the Thermal-Electric Separation / by: (書目-語言資料,印刷品)

建構剪應力之量測裝置與其應用於晶粒接合之評估 = = Construction of the Measurement Device for the Shear Strength and Application of Die-Attached Bonding / by: (書目-語言資料,印刷品)

thermal resistance

黏著應力

錫膏

package

微型投影機光源

電熱分離

bond stress

thermal-electric separation

共晶

junction temperature

封裝

silver paste

tin paste

light source of the mini projector

接面溫度

銀膠

eutectic

熱阻