暫態液相鍵合.
Overview
| Works: | 2 works in 2 publications in 2 languages | |
|---|---|---|
Titles
以鋁鍺錫暫態液相鍵合應用於低溫覆晶封裝之研究 = = The Study of The Low Temperature Flip-Chip Package by Applying AlGeSn-Based Transient Liquid Phase Bonding Technique /
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(Language materials, printed)
鋁鍺銦錫暫態液相鍵結接合面之結構分析 = = Structural analysis of AlGeInSn bonded joints prepared by transient liquid phase bonding /
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(Language materials, printed)