國立虎尾科技大學 |

Language: English

Back

以鋁鍺錫暫態液相鍵合應用於低溫覆晶封裝之研究 = = The Study...

謝佳真

以鋁鍺錫暫態液相鍵合應用於低溫覆晶封裝之研究 = = The Study of The Low Temperature Flip-Chip Package by Applying AlGeSn-Based Transient Liquid Phase Bonding Technique /

Record Type:	Language materials, printed : Monograph/item
Title/Author:	以鋁鍺錫暫態液相鍵合應用於低溫覆晶封裝之研究 =/ 謝佳真撰.
Reminder of title:	The Study of The Low Temperature Flip-Chip Package by Applying AlGeSn-Based Transient Liquid Phase Bonding Technique /
remainder title:	The Study of The Low Temperature Flip-Chip Package by Applying AlGeSn-Based Transient Liquid Phase Bonding Technique.
Author:	謝佳真
Published:	雲林縣 :國立虎尾科技大學 , : 民102.07.,
Description:	[13] ,98面 :圖 ; : 30公分.;
Notes:	指導教授：陳文瑞.
Subject:	暫態液相鍵合. -
Online resource:	http://cetd.lib.nfu.edu.tw/etdservice/view_metadata?etdun=U0028-1208201300362700

以鋁鍺錫暫態液相鍵合應用於低溫覆晶封裝之研究 = = The Study of The Low Temperature Flip-Chip Package by Applying AlGeSn-Based Transient Liquid Phase Bonding Technique /
謝佳真

以鋁鍺錫暫態液相鍵合應用於低溫覆晶封裝之研究 =The Study of The Low Temperature Flip-Chip Package by Applying AlGeSn-Based Transient Liquid Phase Bonding Technique /The Study of The Low Temperature Flip-Chip Package by Applying AlGeSn-Based Transient Liquid Phase Bonding Technique.謝佳真撰. - 初版. - 雲林縣 :國立虎尾科技大學 ,民102.07. - [13] ,98面 :圖 ;30公分.

指導教授：陳文瑞.

含參考書目.Subjects--Topical Terms:

997656
暫態液相鍵合.

以鋁鍺錫暫態液相鍵合應用於低溫覆晶封裝之研究 = = The Study of The Low Temperature Flip-Chip Package by Applying AlGeSn-Based Transient Liquid Phase Bonding Technique /
LDR:00905nam a2200181 i 450 001 757956
008 131014s2013 ch a erm 000 0 chi d
040 $a NFU $b chi $c NFU $e CCR
041 0 # $a chi $b chi $b eng
084 $a 008.160M $b 0424 102 $2 ncsclt
100 1 $a 謝佳真 $3 877693
245 1 0 $a 以鋁鍺錫暫態液相鍵合應用於低溫覆晶封裝之研究 = $b The Study of The Low Temperature Flip-Chip Package by Applying AlGeSn-Based Transient Liquid Phase Bonding Technique / $c 謝佳真撰.
246 3 1 $a The Study of The Low Temperature Flip-Chip Package by Applying AlGeSn-Based Transient Liquid Phase Bonding Technique.
250 $a 初版.
260 # $a 雲林縣 : $b 國立虎尾科技大學 , $c 民102.07.
300 $a [13] ,98面 : $b 圖 ; $c 30公分.
500 $a 指導教授：陳文瑞.
500 $a 碩士論文--國立虎尾科技大學電子工程系碩士班.
504 $a 含參考書目.
650 # 4 $a 暫態液相鍵合. $3 997656
650 # 4 $a 熱蒸鍍. $3 997655
650 # 4 $a 鋁鍺. $3 997654
650 # 4 $a 覆晶封裝. $3 995812
650 # 4 $a transient liquid phase bonding. $3 997653
650 # 4 $a thermal evaporation. $3 997652
650 # 4 $a AlGe. $3 997651
650 # 4 $a flip-chip package. $3 997650
856 4 # $u http://cetd.lib.nfu.edu.tw/etdservice/view_metadata?etdun=U0028-1208201300362700